More-Than-Moore: 3D Heterogeneous Integration into CMOS Technologies

Albert Wang,Qi Chen,Cheng Li,Fei Lu,Chenkun Wang,Feilong Zhang,X. Shawn Wang,Jimmy Ng,Ya-Hong Xie,Rui Ma,Li Wang,Lin
DOI: https://doi.org/10.1109/nems.2017.8016961
2017-01-01
Abstract:Monotonic scaling-down of CMOS integrated circuit (IC) technologies is rapidly approaching to its physical end, yet advances in ICs will continue. Instead of one-dimensional (1D) scaling dawn, one apparent solution is lateral integration of heterogeneous devices in 3-dimensional (3D) fashion, which opens great opportunities to make more complex Si-based microsystems for unlimited applications well beyond ICs, such as, internet of things (IoT). This paper discusses 3D heterogeneous integration of a few non-traditional devices into traditional Si CMOS technologies.
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