Automated Assembly for Mesoscale Parts.
David J. Cappelleri,Peng Cheng,Jonathan Fink,Bogdan Gavrea,Vijay Kumar
DOI: https://doi.org/10.1109/tase.2011.2132128
IF: 6.636
2011-01-01
IEEE Transactions on Automation Science and Engineering
Abstract:This paper describes a test-bed for planar micro and mesoscale manipulation tasks and a framework for planning based on quasi-static models of mechanical systems with intermittent frictional contacts. We show how planar peg-in-the-hole assembly tasks can be designed using randomized motion planning techniques with Mason's models for quasi-static manipulation. Simulation and experimental results are presented in support of our methodology. We develop this further into a systematic approach to incorporating uncertainty into planning manipulation tasks with frictional contacts. We again consider the canonical problem of assembling a peg into a hole at the mesoscale using probes with minimal actuation but with visual feedback from an optical microscope. We consider three sources of uncertainty. First, because of errors in sensing position and orientation of the parts to be assembled, we must consider uncertainty in the sensed configuration of the system. Second, there is uncertainty because of errors in actuation. Third, there are geometric and physical parameters characterizing the environment that are unknown. We discuss the synthesis of robust planning primitives using a single degree-of-freedom probe and the automated generation of plans for mesoscale manipulation. We show simulation and experimental results of our work.Note to Practitioners-Micro and mesoscale systems technology is poised to be an extremely strong economic driver in this century. Market estimations predict large quantities of products involving this technology within the next decade and more specifically, meso and microscale assembly shows enormous potential in a vast range of industrial applications. As more microelectromechanical systems (MEMS), microfluidic, and optoelectronic devices come on the market, the complexity and cost of the required manufacturing equipment and/or skill level of humans to assemble such devices has also increased. Even though there have recently been substantial advances in the fabrication of microparts, the assembly and packaging of microsystems and products still account for roughly 80% of the cost of commercial products. Manual, labor-intensive manufacturing will no longer be an option in this next generation of products that will require assembly at the meso, micro, and nanoscales. Thus, the global trend of miniaturizing products has led to many new assembly challenges that need to be solved in order for companies to remain competitive. Therefore, driven by these increasingly competitive requirements for faster throughput, higher yield, and quicker "time to profit" of products, the need for automated robotic assembly of meso and microsystems is quite apparent. This paper is on deriving the fundamental concepts needed to make these types of systems a reality. System modeling, model fitting, open loop motion plans, robust motion primitives, and quasi-open loop motion plans are synthesized for the canonical peg-in-the-hole assembly task at the mesoscale. Insights on extending the methodology presented to smaller length scales are also provided.