Abstract:Networks-on-chip (NoC) is emerging as a key on-chip communication architecture for multiprocessor systems-on-chip (MPSoC). In traditional electronic NoCs, high bandwidth can be obtained by increasing the number of parallel metallic wires at the cost of more energy consumption. Optical NoCs are thus proposed to achieve low-power ultra-high-bandwidth data transmission in optical domain. Electronic control technology could be a complement to the optical networks. Besides NoCs, three-dimensional integrated circuits (3D ICs) are another attractive solution for system performance improvement by reducing the interconnect length. The investigation of using 3D IC as a platform for the realization of mixed-technology electronic-con trolled optical NoC has not been addressed until recently. In this paper, we propose a 3D electronic-controlled optical NoC implemented in a TSV-based (through-silicon via) two-layer 3D chip. The upper device layer is an optical layer. It integrates an optical data transmission network, which is responsible for optical payload packets transmission. The bottom device layer is an electronic layer. It contains an electronic control network, which Is used to route control packets and configure the optical network. We built an M mesh-based 3D optical NoC, with a 45nm electronic control network. Power comparison with a matched 2D electronic NoC shows that the optical NoC can reduce power consumption significantly. For 2048B packets, it has a 70% power reduction. End-to-end delay (ETE delay) and network throughput of the two NoCs under varying injection rates were evaluated for comparison. The results show that ETE delay of the optical NoC is much smaller than the electronic NoC when the network becomes congested. Take 4096B packets for example, it is 18.7 mu s in the optical NoC with an injection rate of 0.5, while 33.5 mu s in the electronic one. A maximum throughput of 478Gbps can be offered by the optical NoC using 32Gbps optical link bandwidth. Because of the low resource utilization of circuit switching, the maximum throughput of the optical NoC is slightly lower than the electronic one.

DLPS: Dynamic Laser Power Scaling for Optical Network-on-Chip

Managing Laser Power in Silicon-Photonic NoC Through Cache and NoC Reconfiguration

A Scalable Low-Power Optical Chip: Realization and Static Loss Analysis

Exploring a New Adaptive Routing Based on the Dijkstra Algorithm in Optical Networks-on-Chip

Energy-Proportional Data Center Network Architecture Through OS, Switch and Laser Co-design

An Inter/Intra-Chip Optical Network for Manycore Processors

Silicon Photonic Network-on-chip and Enabling Components

A Novel Scheme to Realize A Power-Efficient Wdm Passive Optical Network

Toward a High-Performance and Low-Loss Clos–Benes-Based Optical Network-on-Chip Architecture

A Learning-Based Thermal-Sensitive Power Optimization Approach for Optical NoCs

Energy-Efficient Hybrid Optical-Electronic Network-On-Chip for Future Many-Core Processors

A High-Performance Low-Power Nanophotonic On-Chip Network

3d Optical Networks-On-Chip (Noc) For Multiprocessor Systems-On-Chip (Mpsoc)

PROTEUS: Rule-Based Self-Adaptation in Photonic NoCs for Loss-Aware Co-Management of Laser Power and Performance

Work-in-Progress: Communication Optimization for Thermal Reliable Optical Network-on-Chip

Reconfigurable Photonic Circuit for Controlled Power Delivery to Laser-Driven Accelerators on a Chip

A Low-Cost Light Source for WDM-PONs with Shared High Power Fiber Lasers

Power-aware Provisioning Strategy with Shared Path Protection in Optical WDM Networks

Reconfigurable WDM-PON Empowered by a Low-Cost 8-Channel Directly Modulated Laser Module

Efficient On-Chip Learning for Optical Neural Networks Through Power-Aware Sparse Zeroth-Order Optimization

A Novel Virtual-Cluster Based Architecture of Double-Layer Optical Networks-on-Chip