Abstract:Due to the high surface–to–volume ratio in nanostructured components and devices, thermal transport across the solid–solid interface strongly affects the overall thermal behavior. Materials such as Si, Ge, SiO2 and GaAs are widely used in advanced semiconductor devices. These materials may have differences in both crystal structure and Debye temperature. We have shown that the thermal transport across such interfaces can be improved by inserting an interlayer between the two confining solids. If the two confining solids are similar in crystal structure and lattice constant but different in Debye temperature, it is predicted from the molecular dynamics modeling that an over 50% reduction of the thermal boundary resistance can be achieved by inserting a 1– to 2–nm–thick interlayer which has similar crystal structure and lattice constant as the two solids. In this case, the Debye temperature of the optimized interlayer is approximately the square root of the product of the Debye temperatures of the two solids. However, if the interlayer has large lattice mismatches with the two confining solids, a thin disordered layer is formed in the solid and in the interlayer adjacent to their interface. Such a disordered layer can distort the phonon density of states at the interface and strongly affects the interfacial phonon transport. In this case, it is found that a 70% reduction of the thermal boundary resistance can be achieved if the lattice constant of the interlayer is smaller than that of the two solids and the Debye temperature of the interlayer is approximately the average of the Debye temperatures of the two solids. On the other hand, if the two solids have a large difference in both lattice constant and Debye temperature, the optimized interlayer should have a lattice constant near the average of the lattice constants of the two solids. For this case, an over 60% reduction of the thermal boundary resistance can be achieved if the Debye temperature of the interlayer is equal to or slightly higher than the square root of the product of the Debye temperatures of the two solids. The calculated phonon density of states shows that the distorted phonon spectra induced by large lattice mismatches are generally broader than the phonon spectra of the corresponding undistorted case. The broader interfacial phonon spectra increase the overlap between the phonon spectra of the two solids at the interface which leads to improved thermal boundary transport.

Thermal Transport Across Symmetric and Asymmetric Solid–solid Interfaces

Thermal Transport Through Solid-Solid Interface with an Interlayer

Heat Transfer Characteristics in an Asymmetrical Solid–Liquid System by Molecular Dynamics Simulations

Heat Transport Through A Solid-Liquid Interface System And Its Thermal Rectification Phenomena By Molecular Dynamics Simulations

Molecular Dynamics Simulations of Thermal Transport at the Nanoscale Solid-Liquid Interface

Thermal Boundary Conductance Across Solid–solid Interfaces at High Temperatures: A Microscopic Approach

The Effect Of Solid Interfaces On Thermal Contact Resistance At Low Temperature

Interface thermal conductance and the thermal conductivity of multilayer thin films

Reduction of solid–solid thermal boundary resistance by inserting an interlayer

Thermal Transport in Model Copper-Polyethylene Interfaces.

Thermal transport across atomic-layer material interfaces

Giant Thermal Transport Tuning at a Metal/Ferroelectric Interface

Effect of Interlayer Between Semiconductors on Interfacial Thermal Transport

Temperature dependence of thermal resistance at a solid/liquid interface

The Interfacial Thermal Conductance Spectrum in Nonequilibrium Molecular Dynamics Simulations Considering Anharmonicity, Asymmetry and Quantum Effects

Inelastic Phonon Transport Across Atomically Sharp Metal/semiconductor Interfaces

A molecular dynamics study on the solid–liquid polymer interface: insight into the effect of surface roughness scale and polymer chain length on interfacial thermal resistance

Effect of Thin Film Confined Between Two Dissimilar Solids on Interfacial Thermal Resistance.

Thermal Transport: Molecular Bridge Enables Anomalous Enhancement in Thermal Transport Across Hard-Soft Material Interfaces (adv. Mater. 35/2014)

Thermal Energy Transport across Hard–Soft Interfaces

Study of Interface Roughness Influence on Thermal Resistance Across Double-Layered Films by Molecular Dynamics Simulation