The Influence of Plating Temperature on the Properties of Electroless Ni-Cu-P Alloys on Aluminum
xi ran wang,hui lu,ying wei zhang,xin gang hu,jing wu
DOI: https://doi.org/10.4028/www.scientific.net/AMR.189-193.1096
2011-01-01
Abstract:In this work, the effect of plating temperature on the electroless plating rate and the properties of the electroless Ni-Cu-P deposits was studied. The corrosion resistance, hardness, surface morphology and components of the coating were studied by using electrochemical workstation, digital micro-hardness SEM and EDS. The results show that the optimum plating temperature is 75 degrees C. The deposition rate, hardness and corrosion resistance are all good when the optimal temperature is 75 degrees C. The adhesion between the deposits and the matrix is better. The deposits is smooth and uniformity, smooth by SEM. The deposit contains Ni 77.80%, Cu 7.68%, P 14.52% by the analyses of energy disperse X-ray.
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