Droplet Impingement and Vapor Layer Formation on Hot Hydrophobic Surfaces

ji yong park,andrew gardner,william p king,david g cahill

DOI: https://doi.org/10.1115/1.4027856

2014-01-01

Abstract:We use pump-probe thermal transport measurements and high speed imaging to study the residence time and heat transfer of small (360 mu m diameter) water droplets that bounce from hydrophobic surfaces whose temperature exceeds the boiling point. The structure of the hydrophobic surface is a 10 nm thick fluorocarbon coating on a Si substrate; the Si substrate is also patterned with micron-scale ridges using photolithography to further increase the contact angle. The residence time determined by high-speed imaging is constant at approximate to 1 ms over the temperature range of our study, 110 < T < 210 degrees C. Measurements of the thermal conductance of the interface show that the time of intimate contact between liquid water and the hydrophobic surface is reduced by the rapid formation of a vapor layer and reaches a minimum value of approximate to 0.025 ms at T > 190 degrees C. We tentatively associate this time-scale with a similar to 1 m s(-1) velocity of the liquid/vapor/solid contact line. The amount of heat transferred during the impact, normalized by the droplet volume, ranges from 0.028 J mm(-3) to 0.048 J mm(-3) in the temperature range 110 < T < 210 degrees C. This amount of heat transfer is approximate to 1-2% of the latent heat of evaporation.