Experimental Investigation on Composite Phase-Change Material (Cpcm)-Based Substrate

Jinyan Hu,Run Hu,Yongming Zhu,Xiaobing Luo
DOI: https://doi.org/10.1080/01457632.2015.1052712
IF: 2.3
2015-01-01
Heat Transfer Engineering
Abstract:Many high-power electronic devices such as high-power light-emitting diodes and aerial devices work intermittently. If some of the heat generated by the chips could be stored in the thermal storage medium during the working time and then be released to the ambient in the nonworking time, the heat dissipation load of the heat sinks could be diminished and a better thermal characteristic could be achieved. Inspired by this idea, we proposed a thermal storage substrate and investigated its thermal storage properties by experiment in this study. First, the composite phase-change material (CPCM) was prepared as the thermal storage medium. Second, the thermal and phase-transition properties of the CPCM were studied through differential scanning calorimeter tests. Third, the thermal conductivity of the CPCM was measured for the analysis of thermal performance. Afterward, the CPCM-based substrate was fabricated and several experiments were conducted to examine its thermal storage performance. The results showed that the thermal storage substrate could store the heat, as much as 55,773.80 J, which accounts for 32% of the heat generated by the heat source approximately. With so much heat stored in the CPCM, the temperature of the heat source went up much more slowly. To accelerate the heat conduction inside the CPCM, five aluminum pillars were added into the substrate. As a result, the temperature of the heat source and the substrate wall decreased by 3.5°C and 4.5°C, respectively.
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