Abstract: Carbon nanotubes (CNTs) exhibit a great prospect as a nanoscale building block for future nanoelectronics due to their unique one-dimensional nanostructure and properties [1]. To explore their potential in various domains, an essential prerequisite is to build reliable interconnections between the CNTs and the external electrical circuits and mechanical systems. To address this need, various chemical and physical processes have been explored to build such interconnections. For example, Burghard et al. reported “controlled adsorption of CNTs on chemically modified electrodes” for interconnection of CNTs [2,3]. However, a stronger bonding instead of a weak chemical adsorption is mandatory for constructing reliable nanodevices. Ruoff et al. showed that focused electron beam in a scanning electron microscope (SEM) can be used to deposit a small amount of hydrocarbon contamination so as to attach nanotubes on an AFM tip [4, 5]. Such a “spot welding” technique has also been used for connecting CNTs and polysilicon surface electrically and mechanically [6]. Madsen et al. presented an in situ method for highly conductive attachment of multiwalled carbon nanotubes (MWCNTs) onto microelectrodes by depositing a gold–carbon composite using a focused electron beam system [7]. Although robust contacts can be obtained by the these methods, limited access to a focused electron beam system and the small-scale spot-treatment nature prevent their large-scale industrial applications. To meet the needs of future large-scale applications, simpler, less capital intensive and more scalable processes are highly desirable. In this chapter, we introduce a novel ultrasonic nanowelding process, with which one can fabricate reliable bonding between single-wall carbon nanotubes (SWCNTs) and metal electrodes. Contacts formed by the present process are found to have low contact resistance and good long-term stability and mechanical strength. A low resistance of around 15 k Ω for a 1- µm-long metallic SWCNT at room temperature can be achieved. After nanowelding, the effective Schottky barrier height between semiconducting SWCNT and Ti electrode is as low as ~6:6 meV in the ON-state and the barrier width is ~0:9 nm at Vg = 0. The performance of the CNT field-effect transistors (FETs) fabricated by this method has also been demonstrated to have greatly improved.

Enhanced electron field emission characteristics of single-walled carbon nanotube films by ultrasonic bonding

Mechanical Fabrication of Carbon Nanotube Films and Their Field-Emission Properties

Improvement of Carbon Nanotube Field Emission Properties by Ultrasonic Nanowelding

Outstanding Field Emission Properties Of Wet-Processed Titanium Dioxide Coated Carbon Nanotube Based Field Emission Devices

Ultrasonic Nanowelding of Carbon Nanotubes to Metal Electrodes

Enhanced Field Electron Emission of Single-Walled Carbon Nanotubes Prepared by Imprinting Technique

Self-aligned Split Gate Electrodes Fabricated on Suspended Carbon Nanotubes

Enhanced Field Emission from Carbon Nanotubes by Electroplating of Silver Nanoparticles

All carbon nanotube based flexible field emission devices prepared through a film transfer method

Self-aligned Electrodes for Suspended Carbon Nanotube Structures

Effects of Welding Head on the Carbon Nanotube Field Emission in Ultrasonic Nanowelding

Fabrication and electrical characteristics of carbon nanotube field emission microcathodes with an integrated gate electrode

Ultrasonic Nanowelding Technology Between Carbon Nanotubes and Metal Electrodes

Growth of Aligned Multiwall Carbon Nanotubes and the Effect of Adsorbates on the Field Emission Properties

Formation of Free-Standing Carbon Nanotube Array on Super-Aligned Carbon Nanotube Film and Its Field Emission Properties

Crystalline Multiwall Carbon Nanotubes and Their Application As a Field Emission Electron Source

Fabrication and Electrochemical Properties of Free-Standing Single-Walled Carbon Nanotube Film Electrodes

Fabrication of carbon nanotube field emission film by electrophoresis deposition and sintering

Synthesis and Field Electron Emission Properties of Multi-Walled Carbon Nanotube Films Directly Grown on Catalytic Stainless Steel Substrate

Enhancement of field emission characteristics of tungsten emitters by single-walled carbon nanotube modification

Self-Aligned Growth of Single-Walled Carbon Nanotube Bridging Two Electrodes