Electrochemical Deposition of Copper on Single-Crystal Gallium Nitride(0001) Electrode: Nucleation and Growth Mechanism

Yu Zhao,Feng-Xiang Deng,Li-Feng Hu,Yong-Qiang Liu,Ge-Bo Pan

DOI: https://doi.org/10.1016/j.electacta.2014.03.051

IF: 6.6

2014-01-01

Electrochimica Acta

Abstract:The electrodeposition of Cu on n-type single-crystal GaN(0001) electrode from sulfate solution was investigated by electrochemical techniques and scanning electron microscopy. It was found that Cu deposition on GaN(0001) commenced at a large negative potential of -840 mV vs. Pt/Pt2+ and was quasi-reversible and mass transfer limited. On the basis of Tafel plot, a low exchange current density of similar to 2.3 x 10(-6) mA cm(-2) was calculated. This was mainly due to the limited free electrons in the conduction band of GaN. In addition, the current transient measurements revealed that the deposition process followed the progressive nucleation in 0.5 M H2SO4 +5 mM CuSO4. The instantaneous nucleation was observed only at the large applied potential of -1.1 V. (C) 2014 Elsevier Ltd. All rights reserved.