On the Effect of Water-Induced Degradation of Thin-Film Piezoelectric Microelectromechanical Systems
R. Dahl-Hansen,T. Tybell,A. Vogl,Jon Vedum,F. Tyholdt,J. Gjessing,P. Wittendorp
DOI: https://doi.org/10.1109/JMEMS.2020.3031201
IF: 2.829
2021-02-01
Journal of Microelectromechanical Systems
Abstract:Lifetime and reliability in realistic operating conditions are important parameters for the application of thin-film piezoelectric microelectromechanical systems (piezoMEMS) based on lead zirconate titanate (PZT). Humidity can induce time-dependent dielectric breakdown at a higher rate compared to dry conditions, and significantly alter the dynamic behavior of piezoMEMS-devices. Here we assess the lifetime and reliability of PZT-based micromirrors with and without humidity barriers operated at 23°C in an ambient of 0 and 95 % relative humidity. The correlation of the dynamic response, as well as the ferroelectric, dielectric, and leakage properties, with degradation time was investigated. In humid conditions, the median time-to-failure was increased from <inline-formula> <tex-math notation="LaTeX">${2.7\times }{10}^{4}{[1.9\times }{10}^{4}{-4.0\times }{10}^{4}{]}$ </tex-math></inline-formula> s to <inline-formula> <tex-math notation="LaTeX">${1.1\times }{10}^{6}{[0.9\times }{10}^{6}{-1.5\times }{10}^{6}{]}$ </tex-math></inline-formula> s at 20 <inline-formula> <tex-math notation="LaTeX">$\text{V}_{{\mathrm {AC}}}$ </tex-math></inline-formula> continuous unipolar actuation, by using a 40 nm thick Al<sub>2</sub>O<sub>3</sub> humidity barrier. However, the initial maximum angular deflection, polarization, and dielectric permittivity decreased by about 6, 11, and 12 %, respectively, for Al<sub>2</sub>O<sub>3</sub> capped devices. For both bare and encapsulated devices, the onset of electrothermal breakdown-events was the dominant cause of degradation. Severe distortions in the device’s dynamic behavior, together with failure from loss of angular deflection, preceded time-dependent dielectric breakdown in 95% relative humidity. Moreover, due to the film-substrate stress transfer sensitivity of thin-film devices, water-induced degradation affects the reliability of thin-film piezoMEMS differently than bulk piezoMEMS. [2020-0228]
Physics,Engineering,Materials Science