Nano–micro Structure of Functionalized Boron Nitride and Aluminum Oxide for Epoxy Composites with Enhanced Thermal Conductivity and Breakdown Strength

Lijun Fang,Chao Wu,Rong Qian,Liyuan Xie,Ke Yang,Pingkai Jiang

DOI: https://doi.org/10.1039/c4ra01194e

IF: 4.036

2014-01-01

RSC Advances

Abstract:Nano-micro structure of modified 2-D and 0-D ceramic fillers is designed for epoxy with high thermal conductivity and breakdown strength.

What problem does this paper attempt to address?

Improving Thermal Conductivity of Epoxy Resin by Filling Boron Nitride Nanomaterials: A Molecular Dynamics Investigation

Mingxiao Zhu,Jiacai Li,Jiming Chen,Henggao Song,Hongyu Zhang

DOI: https://doi.org/10.1016/j.commatsci.2019.04.012

IF: 3.572

2019-01-01

Computational Materials Science

Abstract:Several kinds of inorganic nanofillers especially boron nitride (BN) are introduced to improve the thermal conducting properties of epoxy resin (EP). In this work, the influence of BN nanofillers on properties of EP composites is comprehensively investigated by using molecular dynamics (MD) technique. The thermal conductivity of BN/EP composites is calculated by reverse non-equilibrium molecular dynamics (RNEMD) method, then the effects of shapes (nanoparticle, nanotube and nanosheet), volume fractions and aspect ratios of BN nanofillers on the thermal properties are explored. To further elaborate the heat-conducting mechanism of EP composites, temperature gradient distribution and phononic density of states (PDOS) are analyzed. Moreover, the effect of BN volume fractions on the thermal conductivity of the composites is investigated by RNEMD simulation and Nielsen's theoretical model. The results indicate that the improving effectiveness of different BN nanofillers is ranked as nanosheet > nanotube > nanoparticle. This research provides new ideas for improving the thermal conductivity of composites.
Enhanced Thermal and Dielectric Performance of Epoxy Resin/aluminum Nitride Nanocomposites at High Temperatures

Xiangrong Chen,Chao Dai,Tie Jiang,Ashish Paramane

DOI: https://doi.org/10.1002/pc.25802

IF: 5.2

2020-01-01

Polymer Composites

Abstract:The effects of nano-aluminum nitride (nano-AlN) on the thermal conductivity and dielectric performances of epoxy resin (EP) are investigated. The addition of nanoparticles in the materials is characterized. The trap characteristics of the samples are estimated using the surface potential decay (SPD) measurements at high temperatures. The results show that the nano-AlN fillers are well dispersed in the nano-AlN composites. The thermal conductivity consistently increases with an increase of the nano-AlN content. The DC breakdown strength of the EP is enhanced with the addition of the nanoparticles as well, especially for the 0.5 and 1 wt% EP/AlN composites. The DC conductivity of the EP/AlN composites increases more obviously at the high temperature. The initial surface charge density of the samples with the same content of nano-filler decreases with the increase of the temperature. Both the addition of nanoparticles and high temperature can improve the apparent carrier mobility of the EP sample. The trap density and trap level of the deep traps decreases with the increase of the temperature. It is postulated that shallow traps influence the voltage decay in the EP samples and increase the activation energy and the apparent carrier mobility of the specimens at the high temperature.
Silica Nanoparticle-Decorated Alumina Rough Platelets for Effective Reinforcement of Epoxy and Hierarchical Carbon Fiber/epoxy Composites

Huichao Yao,Guodong Zhou,Weitao Wang,Mao Peng

DOI: https://doi.org/10.1016/j.compositesa.2018.04.017

IF: 9.463

2018-01-01

Composites Part A Applied Science and Manufacturing

Abstract:Alumina platelets, similar to 200 nm in thickness, have been previously used as the filler of polymers, especially for bio-inspired nacre-like composites. However, to the best of our knowledge, they have not been applied to hierarchical carbon fiber/epoxy composites. Herein, the effect of smooth alumina platelets and silica nano-particledecorated platelets with nanoasperities on the mechanical properties of epoxy resin and hierarchical composites were investigated. The rough platelets are much more effective than the smooth ones for the reinforcement, because of the greatly improved matrix-filler interactions. The increases of mechanically properties by the submicrometer-thick rough platelets are comparative with or even better than those by carbon nanotubes, nanofibers and graphene derivatives previously reported. The increase of the total energy dissipated during flexural fracture of the hierarchical composites and Mode II interlaminar fracture toughness are also more significant than the smooth platelets. This study provides a new approach for the reinforcement of hierarchical composites.
Nano-BN Encapsulated Micro-Aln As Fillers for Epoxy Composites with High Thermal Conductivity and Sufficient Dielectric Breakdown Strength

Tong Yao,Ke Chen,Tao Shao,Cheng Zhang,Chuyan Zhang,Ying Yang

DOI: https://doi.org/10.1109/tdei.2020.008606

IF: 2.509

2020-01-01

IEEE Transactions on Dielectrics and Electrical Insulation

Abstract:In this work, the nano boron nitride (BN) was modified by poly(dopamine) and micro aluminium nitride (AlN) was modified by y-(2,3-epoxypropoxy)propytrimethoxysilane. Then the nano-BN was anchored though the chemical bonding reaction onto the surface of micro-AlN. The epoxy composites with the BN encapsulated AlN hybrid filler were prepared, showing a enhanced thermal conductivity of 1.449 W/(m-k), which is 946% higher than that of EP, 0.153 W/(m-k). And the results of dielectric breakdown experiments in high voltage at high frequency show that the sufficient dielectric strength with breakdown time of 72.6s, which is 256% higher than that of EP, 28.33s. This work provides a facile method for preparing high-performance epoxy composites with high thermal conductivity and sufficient dielectric breakdown strength.
Thermal Conductivity and Electric Breakdown Strength Properties of Epoxy/Alumina/Boron Nitride Nanosheets Composites

Zhengdong Wang,Yonghong Cheng,Yingyu Shao,Qian Xie,Guanglei Wu

DOI: https://doi.org/10.1109/icd.2016.7547617

2016-01-01

Abstract:Dielectric polymer composites with high thermal conductivity and high electric breakdown strength are needed for high voltage devices. Epoxy resins is an excellent electrically insulating material, but low thermal conductivity limits its applications. This work aims to effectively enhance the thermal conductivity and keep the breakdown strength of composites as high as possible. In this study, α-alumina (α-Al 2 O 3 ) particles with an average size of 0.2µm, and boron nitride nanosheets (BNNSs) with an average diameter of 1µm and thickness of around 40nm were homogeneously mixed with epoxy resin, and a three-phase composite was thus obtained. The superiority of this method is that three-phase composites not only show significantly increased thermal conductivity but also have higher breakdown strength in comparison with that of the two-phase α-Al203/epoxy composites. It is clear that epoxy with hybrid fillers has great promising for high thermal conductive insulating materials for the high voltage insulation.
Alignment of Boron Nitride Nanofibers in Epoxy Composite Films for Thermal Conductivity and Dielectric Breakdown Strength Improvement

Zhengdong Wang,Jingya Liu,Yonghong Cheng,Siyu Chen,Mengmeng Yang,Jialiang Huang,Hongkang Wang,Guanglei Wu,Hongjing Wu

DOI: https://doi.org/10.3390/nano8040242

IF: 5.3

2018-01-01

Nanomaterials

Abstract:Development of polymer-based composites with simultaneously high thermal conductivity and breakdown strength has attracted considerable attention owing to their important applications in both electronic and electric industries. In this work, boron nitride (BN) nanofibers (BNNF) are successfully prepared as fillers, which are used for epoxy composites. In addition, the BNNF in epoxy composites are aligned by using a film casting method. The composites show enhanced thermal conductivity and dielectric breakdown strength. For instance, after doping with BNNF of 2 wt%, the thermal conductivity of composites increased by 36.4% in comparison with that of the epoxy matrix. Meanwhile, the breakdown strength of the composite with 1 wt% BNNF is 122.9 kV/mm, which increased by 6.8% more than that of neat epoxy (115.1 kV/mm). Moreover, the composites have maintained a low dielectric constant and alternating current conductivity among the range of full frequency, and show a higher thermal decomposition temperature and glass-transition temperature. The composites with aligning BNNF have wide application prospects in electronic packaging material and printed circuit boards.
Boron nitride nanosheet @ quantum‐sized diamond nanocrystal complex/epoxy nanocomposites with enhancing thermal conductivity and sufficient dielectric breakdown strength

Zhengdong Wang,Yuanhang Zhou,Tong Zhang,Meng Luo,Xiaolong Cao,Ganqiu Yang,Wei Sun

DOI: https://doi.org/10.1002/pc.27985

IF: 5.2

2023-12-03

Polymer Composites

Abstract:The epoxy‐based film with enhanced thermal conductivity and sufficient dielectric breakdown strength was prepared via the introduction of a novel BA@DN filler with multilevel overlapping interface and small size effect. With the development of high‐voltage and high‐power devices in the direction of compactness, lightness and extreme working environments, the contradiction between thermal conductivity and dielectric breakdown strength is becoming more and more obvious. In this work, a novel boron nitride nanosheet with uniformly dispersed diamond nanocrystalline (abbreviated as BA@DN) was prepared via facile acidizing hydroxylation, in situ copolymerization self‐assembly of dopamine and blending process. The obtained hybrid filler was employed to embed into epoxy matrix, showing enhanced thermal conductivity and sufficient dielectric breakdown strength. For example, the through‐plane and in‐plane thermal conductivity of epoxy composite with 5% BA@DN‐2 reaches to 0.56 and 3.824 W/m K, respectively. The study proposes a modified plane thermal conductivity model. Based on calculations, it was found that the modified thermal conductivity of 5% BA@DN‐2 is 3.47 W/m K, which is significantly higher than that of pure EP, specifically 17.35 times higher. These findings are significant in terms of materials science. while its alternating current and direct current dielectric breakdown strength are 48.84 and 136.31 kV/mm, about 85.68% and 99.1% of pure epoxy, respectively. The mechanism of outstanding dielectric breakdown strength was analyzed via dielectric characteristic, partial discharge performance and the theory of quantum size effect. In addition, a modified multi‐core model with a multilevel overlapping interface is presented. Highlights The acidified diamond nanocrystals (DNs) were attached to dopamine‐coated boron nitride nanocrystals by a blending process. The small size effect of DNs allows the epoxy film to have both high thermal conductivity and high insulation properties. A thermal conductivity correction model is proposed to eliminate the effect of graphite layer on the film.

materials science, composites,polymer science
The synergistic effects of the micro-BN and nano-Al2O3 in micro-nano composites on enhancing the thermal conductivity for insulating epoxy resin

Wancong Bian,Tong Yao,Ming Chen,Cheng Zhang,Tao Shao,Ying Yang

DOI: https://doi.org/10.1016/j.compscitech.2018.10.002

IF: 9.1

2018-01-01

Composites Science and Technology

Abstract:Epoxy resin has been widely used in electrical and electronics industries due to its excellent adhesion and insulating properties. However, the low thermal conductivity limits its application in the devices, especially under the working conditions of high frequency. In this work, the epoxy resin composites filled with binary fillers of dopamine modified micro-BN and KH550 modified nano-Al2O3 were fabricated and the thermal conductivities, dielectric losses and breakdown strengths in high frequency and electrical field of the composites were studied. A high thermal conductivity of 1.182 W m−1K−1 was realized in the composite with 22.5 wt% BN and 7.5 wt% Al2O3, which was about 700% higher than neat epoxy resin. The results of breakdown experiments in high frequency and high voltage field showed that the positive effect of the thermal conductivity increase was greater than the negative effect of the dielectric loss increase, and the notably improved breakdown time of the composite was 406% higher than that of neat epoxy. The epoxy resin composites with high thermal conductivity and excellent dielectric strength could be a potential insulating material in the electrical and electronics industries.
Design of hBN/nano Al2O3 epoxy composites with enhanced thermally conductive and dielectric properties

Wang, Haohuan

DOI: https://doi.org/10.1007/s10854-024-13551-y

2024-09-23

Journal of Materials Science Materials in Electronics

Abstract:The overall performance of 3D printed epoxy resin falls short of meeting the demands for the production and advancement of insulating components in electrified transportation equipment. This article introduces an approach for enhancing the dielectric characteristics of a composite epoxy resin oriented with hexagonal boron nitride by incorporating nano-alumina. Consequently, a 3D printed composite epoxy resin comprising nano-alumina and hexagonal boron nitride is successfully fabricated, demonstrating exceptional physical, chemical, and dielectric properties. The research findings unveil that, when the filler content reaches 3 wt% for nano-alumina and 27 wt% for hexagonal boron nitride, the micro-nano composite epoxy resin exhibits impressive mechanical characteristics while maintaining a significant degree of thermally conductive anisotropy. Specifically, at this precise filler content, the interlayer compatibility within the micro-nano composite epoxy resin experiences a substantial improvement, ultimately resulting in outstanding dielectric performance with a maximum volume resistivity of 5.5 × 10 15 Ω∙cm and a surface resistivity of approximately 6.2 × 10 14 Ω. Furthermore, the micro-nano composite epoxy resin, with in-plane-oriented hBN, exhibits the highest dielectric strength, achieving a peak value of 35.7 kV∙mm −1 at the mentioned filler content. This investigation offers valuable insights into the development of high-performance 3D printed insulation components.

engineering, electrical & electronic,materials science, multidisciplinary,physics, condensed matter, applied
Effect of Al2O3 with Different Nanostructures on the Insulating Properties of Epoxy-Based Composites

Yongzhe Tang,Guanghui Ge,Yuxia Li,Liangsong Huang

DOI: https://doi.org/10.3390/ma13194235

IF: 3.4

2020-09-23

Materials

Abstract:High thermal conductivity insulating dielectrics with good electrical properties have received widespread attention due to the continuous development of power systems and power electronic technologies. In this paper, the effects of differently structured nano alumina fillers on the thermal conductivity and insulating properties of polymer-based composites were studied. It was found that all three types of Al2O3 nano-fillers enhanced the thermal conductivity of the composites, and the thermal conductivity increased more dramatically with increasing filler particle size. It is worth noting that Al2O3 nanowires (NWs) exhibited the most significant improvement in thermal conductivity. The volume resistivity of the composites first increased and then decreased with increasing mass fraction of fillers, and Al2O3 nanoplates (NPLs) showed the most significant improvement in the insulation performance of the composites. The dielectric constants of the composites increased with increasing mass fraction of fillers, while the dielectric losses first decreased and then increased with the same trend, yet the mass fractions of fillers for the three materials were different when the dielectric loss reached a minimum. In addition, all three types of filler increased the AC breakdown strength of the composites, but Al2O3-NPLs showed the most significant improvement on the breakdown performance of the composites.

materials science, multidisciplinary,chemistry, physical,physics, applied, condensed matter,metallurgy & metallurgical engineering
Simultaneously enhanced dielectric properties and through-plane thermal conductivity of epoxy composites with alumina and boron nitride nanosheets

Zhengdong Wang,Guodong Meng,Liangliang Wang,Liliang Tian,Siyu Chen,Guanglei Wu,Bo Kong,Yonghong Cheng

DOI: https://doi.org/10.1038/s41598-021-81925-x

IF: 4.6

2021-01-28

Scientific Reports

Abstract:Abstract Dielectric materials with good thermal transport performance and desirable dielectric properties have significant potential to address the critical challenges of heat dissipation for microelectronic devices and power equipment under high electric field. This work reported the role of synergistic effect and interface on through-plane thermal conductivity and dielectric properties by intercalating the hybrid fillers of the alumina and boron nitride nanosheets (BNNs) into epoxy resin. For instance, epoxy composite with hybrid fillers at a relatively low loading shows an increase of around 3 times in through-plane thermal conductivity and maintains a close dielectric breakdown strength compared to pure epoxy. Meanwhile, the epoxy composite shows extremely low dielectric loss of 0.0024 at room temperature and 0.022 at 100 °C and 10 −1 Hz. And covalent bonding and hydrogen-bond interaction models were presented for analyzing the thermal conductivity and dielectric properties.

multidisciplinary sciences
Thermal Conductivity and Breakdown Strength Study of Micro/Nano-Alumina/Epoxy Resin Composite

Wang Qi,Li Zhe,Yin Yi,Wu Jiandong

DOI: https://doi.org/10.3969/j.issn.1009-9239.2013.02.014

2013-01-01

Abstract:To study the effects of micro-alumina and nano-alumina inorganic particles on the thermal conductivity and electrical properties of epoxy resin,micro-alumina and nano-alumina/epoxy resin composites with various micro-size and nano-size alumina contents were prepared.The results show that the nano-alumina enhances the breakdown strength of the epoxy resin while micro-alumina reduces it.The thermal conductivity of the epoxy resin increases with the increase of the alumina contents.Because of the high thermal resistance between nano-alumina and epoxy resin,the effects of the nano-alumina on the thermal conductivity of the epoxy resin are comparatively smaller.
Boride ceramics covalent functionalization and its effect on the thermal conductivity of epoxy composites

zhiqiang yu,yicheng wu,bin wei,horst baier

DOI: https://doi.org/10.1016/j.matchemphys.2015.08.049

IF: 4.778

2015-01-01

Materials Chemistry and Physics

Abstract:Zirconium diboride/aluminium oxide (ZrB2/Al2O3) composite particles were functionalized with epoxide functionalized γ-glycidoxypropyltrimethoxysilane by the covalent bonding approach to improve the interfacial compatibility of composite particles in epoxy matrix. The composites of epoxy resin filled with functionalized ZrB2/Al2O3 were prepared by in situ bulk condensation polymerization of bisphenol A and epichlorohydrin in the presence of ZrB2/Al2O3. The heat-conducting properties of composites were investigated by the finite element method (FEM) and the thermal conductivity test. The finite-element program ANSYS was used for this numerical analysis, and three-dimensional spheres-in-cube lattice array models were built to simulate the microstructure of composite materials for different filler contents. The thermal conductivity of composites was determined by laser flash method (LFA447 Nanoflash), using the measured heat capacity and thermal diffusivity, with separately entered density data. The results show that the effective chemical bonds are formed between ZrB2/Al2O3 and γ-glycidoxypropyltrimethoxysilane after the surface functionalization. The interfacial compatibility and bonding of modified particles with the epoxy matrix are improved. The thermal conductivities of functionalized composites with 3 vol% and 5 vol% loading are increased by 8.3% and 12.5% relative to the unmodified composites, respectively. Comparison of experimental values and calculated values of the thermal conductivity, the average relative differences are under 5%. The predictive values of thermal conductivity of epoxy composites are in reasonable agreement with the experimental values.
Thermal Stability and Dynamic Mechanical Behavior of Functional Multiphase Boride Ceramics/epoxy Composites

Yannan He,Zhiqiang Yu

DOI: https://doi.org/10.1515/polyeng-2018-0375

IF: 1.624

2019-01-01

Journal of Polymer Engineering

Abstract:Abstract The thermal and dynamic mechanical properties of epoxy composites filled with zirconium diboride/nano-alumina (ZrB2/Al2O3) multiphase particles were investigated by means of differential scanning calorimetry, dynamic thermo-mechanical analysis, and numerical simulation. ZrB2/Al2O3 particles were surface organic functional modified by γ-glycidoxypropyltrimethoxysilane for the improvement of their dispersity in epoxy matrix. The results indicated that the curing exotherm of epoxy resin decreased significantly due to the addition of ZrB2/Al2O3 multiphase particles. In comparison to the composites filled with unmodified particles, the modified multiphase particles made the corresponding filling composites exhibit lower curing reaction heat, lower loss modulus, and higher storage modulus. Generally speaking, the composites filled with 5 wt% modified multiphase particles presented the best thermal stability and thermo-mechanical properties due to the better filler-matrix interfacial compatibility and the uniform dispersity of modified particles. Finite element analysis also suggested that the introduction of modified ZrB2/Al2O3 multiphase particles increased the stiffness of the corresponding composites.
Enhanced Thermal Conductivity of Epoxy Composites Filled with Al2O3/Boron Nitride Hybrids for Underfill Encapsulation Materials

William Anderson Lee Sanchez,Chen-Yang Huang,Jian-Xun Chen,Yu-Chian Soong,Ying-Nan Chan,Kuo-Chan Chiou,Tzong-Ming Lee,Chih-Chia Cheng,Chih-Wei Chiu

DOI: https://doi.org/10.3390/polym13010147

IF: 5

2021-01-01

Polymers

Abstract:In this study, a thermal conductivity of 0.22 W·m−1·K−1 was obtained for pristine epoxy (EP), and the impact of a hybrid filler composed of two-dimensional (2D) flake-like boron nitride (BN) and zero-dimensional (0D) spherical micro-sized aluminum oxide (Al2O3) on the thermal conductivity of epoxy resin was investigated. With 80 wt.% hybrid Al2O3–BN filler contents, the thermal conductivity of the EP composite reached 1.72 W·m−1·K−1, increasing approximately 7.8-fold with respect to the pure epoxy matrix. Furthermore, different important properties for the application were analyzed, such as Fourier-transform infrared (FTIR) spectra, viscosity, morphology, coefficient of thermal expansion (CTE), glass transition temperature (Tg), decomposition temperature (Td), dielectric properties, and thermal infrared images. The obtained thermal performance is suitable for specific electronic applications such as flip-chip underfill packaging.

polymer science
The Thermal Conductivity and Electrical Strength of Epoxy Resin with Different Filler Content of Micro and Nano Alumina

Wang Qi,Li Zhe,Wu Jiandong,Yin Yi

DOI: https://doi.org/10.1109/cmd.2012.6416352

2012-01-01

Abstract:Epoxy resin is widely used in high voltage apparatus, electrical machines etc due to its excellent mechanical, electrical and chemical properties. Great progress has been made in application on electrical insulation, casting and potting. The epoxy resin containing nano-size and micro-size Al2O3 of various contents are prepared. The purpose of efforts we engaged in is to study the efforts of nano Al2O3, micro Al2O3 and nano-micro Al2O3 on the characteristics of epoxy resin on electrical and thermal properties. The epoxy resin(UVR6105) is used as the base material and Methyl six hydrogen anhydride is used as the curing agent. Various nanocomposites, microcomposites and nano-microcomposites are prepared and fabricated properly through three roller grinding machine. Breakdown strength experiments are done through JNC801 breakdown voltage tester. Nano Al2O3 enhances the electrical characteristics of epoxy resin on breakdown strength while micro Al2O3 lowers it. The thermal properties of thermal conductivity of the epoxy resin are tested through LFA477. The thermal conductivity of epoxy resin is increasing with the filling contents of the Al2O3 while there is a comparatively lower value if nano Al2O3 is added due to its high thermal interface resistance between epoxy resin and Al2O3.
Role of Micro-nano Hexagonal Boron Nitride Coordination on Thermal Conductivity and Breakdown Strength of Epoxy Composites

Zhuolin Cheng,Jiao Xiang,Chuang Zhang,Hang Fu,Lei Xin,Xiaotong Zhang,Shihang Wang,Jianying Li

DOI: https://doi.org/10.1109/ichve49031.2020.9279570

2020-01-01

Abstract:Epoxy resin (EP) has been used as insulating material in power electronic transformer (PET), while low thermal conductivity of EP limits the heat dissipation efficiency of PET. Role of Micro-nano hexagonal boron nitride coordination on thermal conductivity and breakdown strength of epoxy composites was explored. A thermal conductivity of 0.544 W/(m·K) was obtained for 10 wt% BN/EP micro composites, increased by 149.5% compared with pristine epoxy. In addition, the specimen with a dual doping of 10 wt% h-BN and 5 wt% nano filler exhibited both improved thermal conductivity of 0.527 W/(m·K) and breakdown strength of 118.3 kV/mm. It is found that micro-BN could effectively increase the thermal conductivity since efficient heat transform path would be built inside epoxy matrix. Meanwhile, nano-BN would bring in independent interfacial regions that capture carriers at low filler content. Based on the coordination of micro-nano particles, the thermal conductivity and breakdown strength can thus be enhanced simultaneously.
Aluminum Borate/Boron Nitride Nanosheet Fibers for Enhancing the Thermal Conductivity of Polymer Composites

Xiao Hou,Zhenbang Zhang,Xianzhe Wei,Yue Qin,Guichen Song,Linhong Li,Maohua Li,Wen Dai,Su Zhao,Cheng-Te Lin,Nan Jiang,Jinhong Yu

DOI: https://doi.org/10.1021/acsanm.0c03429

IF: 6.14

2021-02-17

ACS Applied Nano Materials

Abstract:Two-dimensional nanomaterials is an intensive research area, but the anisotropy of two-dimensional nanomaterials limits its performance release and application. As a typical two-dimensional nanomaterials, boron nitride nanosheets (BNNSs) exhibit distinct properties in many fields. In order to realize full utilization of its advantageous performance, researchers carried out a large number of investigation methods. In this work, an efficiently orienting strategy of BNNS was reported in which aluminum borate welds the BNNSs, which displays weak interaction between adjacent nanosheets. Taking it as thermally conductive filler, the thermal transportation performance of poly(dimethylsiloxane)-based composites was investigated. Owing to the interaction of BNNSs, the composites exhibit significant thermal conductivity enhancement. The sample's surface temperature in the heating and cooling process was also captured by an IR thermal camera to further reveal the sample's heat-transfer property. This work points at an effective strategy to construct a phonon-transfer channel in thermal management materials by controlling the two-dimensional nanomaterial orientation and has potential applications in other nanomaterial fields.The Supporting Information is available free of charge at <a class="ext-link" href="/doi/10.1021/acsanm.0c03429?goto=supporting-info">https://pubs.acs.org/doi/10.1021/acsanm.0c03429</a>.Digital photograph of carbon fibers (T800), TGA curves of BNNS, aluminum sulfate octadecahydrate, and the mixture, ratio of a dispersion of aluminum sulfate octadecahydrate and BNNS, and TGA curves of a series of PDMS/aluminum borate/BNNS fiber composites (<a class="ext-link" href="/doi/suppl/10.1021/acsanm.0c03429/suppl_file/an0c03429_si_001.pdf">PDF</a>)This article has not yet been cited by other publications.

materials science, multidisciplinary,nanoscience & nanotechnology
Aminopropyltrimethoxysilane-functionalized Boron Nitride Nanotube Based Epoxy Nanocomposites with Simultaneous High Thermal Conductivity and Excellent Electrical Insulation

Chi Zhang,Rongjin Huang,Yongguang Wang,Zhixiong Wu,Shibin Guo,Hua Zhang,Jian Li,Chuanjun Huang,Wei Wang,Laifeng Li

DOI: https://doi.org/10.1039/c8ta07435f

IF: 11.9

2018-01-01

Journal of Materials Chemistry A

Abstract:An ideal dielectric epoxy nanocomposite with high thermal conductivity is successfully fabricated utilizing aminopropyltrimethoxysilane-functionalized BNNTs.
Interfacial Modification of Boron Nitride Nanoplatelets for Epoxy Composites with Improved Thermal Properties

Jinhong Yu,Xingyi Huang,Chao Wu,Xinfeng Wu,Genlin Wang,Pingkai Jiang

DOI: https://doi.org/10.1016/j.polymer.2011.12.040

IF: 4.6

2011-01-01

Polymer

Abstract:Interface is a critical factor in determining the properties of polymer composites. Generally, the physicochemical properties of the interface are closely associated with the surface chemistry of fillers. In this study, we report a simple method to fabricate boron nitride (BN) nanoplatelets using a sonication-centrifugation technique and investigate the effects of functionalization BN nanoplatelets on thermal properties of epoxy composites. Two methods have been used for functionalizing BN nanoplatelets: non-covalent functionalization by octadecylamine (ODA) and covalent functionalization by hyperbranched aromatic polyamide (HBP). The functionalized BN nanoplatelets were characterized by Fourier-transform infrared (FT-IR), nuclear magnetic resonance (H-1 NMR), thermogravimetric analyzer (TGA), and transmission electron microscopy (TEM). Epoxy composites were fabricated by incorporating three kinds of fillers: BN nanoplatelets, BN nanoplatelets functionalized by ODA (BN-ODA), and BN nanoplatelets functionalized by HBP (BN-HBP). Our results show that the BN-HBP results in a strong interface and thus the composites exhibit significantly increased glass transition temperature, thermal decomposition temperature, thermal conductivity and dynamic thermal mechanical modulus. BN-ODA produced intermediate interface interaction, resulting in a moderate improvement of thermal properties. The composites with BN nanoplatelets show the least improvements of thermal properties. (C) 2011 Elsevier Ltd. All rights reserved.

Nano–micro Structure of Functionalized Boron Nitride and Aluminum Oxide for Epoxy Composites with Enhanced Thermal Conductivity and Breakdown Strength

Improving Thermal Conductivity of Epoxy Resin by Filling Boron Nitride Nanomaterials: A Molecular Dynamics Investigation

Enhanced Thermal and Dielectric Performance of Epoxy Resin/aluminum Nitride Nanocomposites at High Temperatures

Silica Nanoparticle-Decorated Alumina Rough Platelets for Effective Reinforcement of Epoxy and Hierarchical Carbon Fiber/epoxy Composites

Nano-BN Encapsulated Micro-Aln As Fillers for Epoxy Composites with High Thermal Conductivity and Sufficient Dielectric Breakdown Strength

Thermal Conductivity and Electric Breakdown Strength Properties of Epoxy/Alumina/Boron Nitride Nanosheets Composites

Alignment of Boron Nitride Nanofibers in Epoxy Composite Films for Thermal Conductivity and Dielectric Breakdown Strength Improvement

Boron nitride nanosheet @ quantum‐sized diamond nanocrystal complex/epoxy nanocomposites with enhancing thermal conductivity and sufficient dielectric breakdown strength

The synergistic effects of the micro-BN and nano-Al2O3 in micro-nano composites on enhancing the thermal conductivity for insulating epoxy resin

Design of hBN/nano Al2O3 epoxy composites with enhanced thermally conductive and dielectric properties

Effect of Al2O3 with Different Nanostructures on the Insulating Properties of Epoxy-Based Composites

Simultaneously enhanced dielectric properties and through-plane thermal conductivity of epoxy composites with alumina and boron nitride nanosheets

Thermal Conductivity and Breakdown Strength Study of Micro/Nano-Alumina/Epoxy Resin Composite

Boride ceramics covalent functionalization and its effect on the thermal conductivity of epoxy composites

Thermal Stability and Dynamic Mechanical Behavior of Functional Multiphase Boride Ceramics/epoxy Composites

Enhanced Thermal Conductivity of Epoxy Composites Filled with Al2O3/Boron Nitride Hybrids for Underfill Encapsulation Materials

The Thermal Conductivity and Electrical Strength of Epoxy Resin with Different Filler Content of Micro and Nano Alumina

Role of Micro-nano Hexagonal Boron Nitride Coordination on Thermal Conductivity and Breakdown Strength of Epoxy Composites

Aluminum Borate/Boron Nitride Nanosheet Fibers for Enhancing the Thermal Conductivity of Polymer Composites

Aminopropyltrimethoxysilane-functionalized Boron Nitride Nanotube Based Epoxy Nanocomposites with Simultaneous High Thermal Conductivity and Excellent Electrical Insulation

Interfacial Modification of Boron Nitride Nanoplatelets for Epoxy Composites with Improved Thermal Properties