A General Purpose Adhesive for Microelectronic Devices

K Xu,J Economy
1999-01-01
Abstract:Polyimides (PI) have been extensively used throughout the microelectronics industry as a polymer dielectric. However, the poor adhesive properties of polyimide can result in poor reliability in devices. In this research, the authors find that this newly developed aromatic thermosetting copolyesters (ATSP) provide a unique solution to this problem and at the same time show very good adhesion to metals such as aluminum, titanium, and steel; as well as to ceramics such as silicon and silicon oxide. The ATSP has been shown to bond with itself through a unique interchain transesterification reaction (ITR) at the interfaces between these polymers. A matrix of experiments for ultra-thin bonding different substrates via ITR has been conducted using a modified tensile test to evaluate the bond strength. The results show ATSP can be used as a general-purpose adhesive for bonding different materials together, and particularly, for PI to solve its poor adhesion in microelectronic devices. Also, this study provides the first known reported data on the behavior of thin film adhesive with bondline down to sub-micron dimensions.
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