Abstract:The special mixed boundary value problem in which a debonded conducting rigid line inclusion is embedded at the interface of two piezoelectric half planes is solved analytically by employing the 8-D Stroh formalism. Different from existing interface insulating crack model and interface conducting rigid line inclusion model, the presently analyzed model is based on the assumption that all of the physical quantities, i.e., tractions, displacements, normal component of electric displacements and electric potential, are discontinuous across the interface defect. Explicit solutions for stress singularities at the tips of debonded conducting rigid line inclusion are obtained. Closed form solutions for the distribution of tractions on the interface, surface opening displacements and jump in electric potential on the debonded inclusion are also obtained, in addition real form solutions for these physical quantities are derived. Various forms of interface defect problems encountered in practice are solved within a unified framework and the stress singularities induced by those interface defects are discussed in detail. Particularly, we find that the analysis of interface cracks between the embedded electrode layer and piezoelectric ceramics can also be carried out within the unified framework.

MN-05 ON THE MODELLING OF STRESS SINGULARITY AT THE INTERFACE EDGE BETWEEN PIEZOELECTRIC THIN FILM AND ELASTIC SUBSTRATE

On Stress Singularity at the Interface Edge Between Piezoelectric Thin Film and Elastic Substrate

Order of singularity and singular stress field about an axisymmetric interface corner in three-dimensional isotropic elasticity

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Stress Singularity at the Edge of Fiber/Matrix Interface

Singularity at the Interface Edge of Bonded Transversely Isotropic Piezoelectric Dissimilar Materials

Singularities Interacting with Interfaces Incorporating Surface Elasticity under Plane Strain Deformations

Stress singularity of one-dimensional hexagonal piezoelectric quasicrystal composites due to thermal effect

THERMOELASTIC ANALYSIS OF INTERFACIAL STRESS AND STRESS SINGULARITY BETWEEN A THIN FILM AND ITS SUBSTRATE

Experimental Study on the Singularities of Electroelastic Fields Around V-Shaped Notch Tip in Piezoelectric Materials

Edge Singularity of Bonded Piezoelectric Materials with Repeated Eigenvalues

A Method for Determining Elastic-Plastic Stress Singularity at the Interface Edge of Bonded Power Law Hardening Materials

Stress Singularities at the Frictional Contact Interface Edge with Small Slipping.

Time dependent singular behaviours at interface edges of chip

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SingularResidual Stress Field Near the Interface Edge.

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