Abstract:Maps of dense subcellular features in biological tissue are the key to understanding the structural basis of organ function. Electron microscopy provides the necessary resolution, yet - as electrons penetrate samples for only a few 100s of nm - requires physical sectioning or ablation, which strongly challenges anatomical investigations of entire organs such as mammalian brains. As demonstrated for the engineering and physical sciences, X-ray nanotomography represents a promising alternative for ultrastructural 3d imaging without physical sectioning . Leveraging the high brilliance of 4th generation synchrotron X-ray sources, it has the potential to non-destructively image mm -sized samples at ultrastructural resolution within a few days . A fundamental barrier to application to the life sciences is that, when irradiated with high-intensity X-rays, biological samples deform and ultimately disintegrate, prohibiting reaching sufficient resolution. Here, we introduce a combination of engineering solutions which defeat this barrier for X-ray ptychography , a coherent diffractive X-ray imaging technique. The solutions include a cryogenic sample stage with high stability, high-precision interferometric positioners and tailored non-rigid tomographic reconstruction algorithms . Furthermore, adapting an epoxy resin developed for the nuclear and aerospace industry, we demonstrate radiation resistance to X-ray doses exceeding 10 Gy. The resulting sub-40 nm isotropic resolution makes it possible to densely resolve axon bundles, boutons, dendrites and reliably identify synapses without physical sectioning. Moreover, we validated the X-ray technique using the current gold standard, namely focused ion beam scanning electron microscopy (FIB-SEM) to demonstrate intact ultrastructure in tissue volumes first imaged by X-rays. This unlocks the potential of X-ray tomography for high-resolution tissue imaging, coinciding with the transformative advancements of next-generation synchrotrons worldwide .

Tomographic Observation of Integrated Circuit Based on X-Ray Microscopy

Three-dimensional imaging of integrated circuits with macro- to nanoscale zoom

Nanoscale Three-Dimensional Imaging of Integrated Circuits using a Scanning Electron Microscope and Transition-Edge Sensor Spectrometer

High-resolution Picosecond Acoustic Microscopy for Non-Invasive Characterization of Buried Interfaces

Direct Imaging of Integrated Circuits in CPU with 60 nm Super-Resolution Optical Microscope

Thermal Visualization of Buried Interfaces by Transient and Steady-State Responses of Time-Domain Thermoreflectance

Laboratory X-ray Microscopy of 3D Nanostructures in the Hard X-ray Regime Enabled by a Combination of Multilayer X-ray Optics

Thermal Visualization of Buried Interfaces Enabled by Ratio Signal and Steady-State Heating of Time-Domain Thermoreflectance

Three-dimensional micro-X-ray topography using focused sheet-shaped X-ray beam

High-Resolution Scanning X-ray Diffraction Microscopy

3D visualization and characterization of nano structured materials

Nanophotonic inspection of deep-subwavelength integrated optoelectronic chips

In-situ X-ray Microscopy of Crack-Propagation to Study Fracture Mechanics of On-Chip Interconnect Structures

Thermal Conductivity Imaging at Micrometre-Scale Resolution for Combinatorial Studies of Materials

Laboratory High-Contrast X-ray Microscopy of Copper Nanostructures Enabled by a Liquid-Metal-Jet X-ray Source

Non-destructive X-ray tomography of brain tissue ultrastructure

Ultra-High Frequency Acoustic Micro-Imaging Simulation on Defect Detection at the TSV-Cu Bulk/Bonding Interface

Three Dimensionial Surface Modelling: A Novel Analysis Technique for Non-Destructive X-Ray Diffraction Imaging of Semiconductor Die Warpage & Strain in Fully Encapsulated Integrated Circuits

Correlative Nanoscale 3D Imaging of Structure and Composition in Extended Objects

Electron Thermal Microscopy