Abstract:Defects such as voids and inclusions are inevitably inserted in the process of improving the mechanical properties by adjusting the microstructure, which results in alteration of deformation mechanism and ductile failure of the material. Although this is a macroscopic phenomenon, it is related to the mechanism at the atomic scale. In this paper, the uniaxial tension processes of Ni–Cu nanotwins containing a void are simulated using the molecular dynamics method, and the effects of the loading direction of perpendicular and parallel to the twin boundary (TB) on the mechanical properties are investigated, and the emphasis is on the hardening behavior after yielding. The results show that the yielding of the material is attributed to the emission of dislocation shear loops on the void surface. The elastic modulus and yield strength are greater under the loading direction of perpendicular to TB. The peak stress is equal to the yield stress under perpendicular loading, while the peak stress is greater than the yield stress under parallel loading. In addition, the hardening behavior is found after yielding under two tensile directions, but the hardening mechanisms are different. For perpendicular loading, the hardening behavior is controlled by the TB and the Lomer-Cottrel lock. While for parallel loading, the hardening behavior is controlled by the stacking faults that distributes uniformly and symmetrically along the TB. The general conclusions obtained may provide new insights into the microscopic properties and deformation mechanisms of nanotwins in depth.

Atomistic Investigations of Tensile and Shear Mechanical Properties of Nanotwinned Copper with Embedded Defects

Atomistic Exploration of Deformation Properties of Copper Nanowires with Pre-Existing Defects

Atomistic Numerical Investigation of Single-crystal Copper Nanowire with Surface Defects

Advanced Numerical Characterization of Mono-Crystalline Copper with Defects

Exploration of the Defect’s Effect on the Mechanical Properties of Different Orientated Nanowires

MD Investigations for Mechanical Properties of Copper Nanowires with and Without Surface Defects

Simulating Size and Volume Fraction-Dependent Strength and Ductility of Nanotwinned Composite Copper

Numerical Exploration Of The Defect'S Effect On Mechanical Properties Of Nanowires Under Torsion

Modeling Grain Size Dependent Optimal Twin Spacing for Achieving Ultimate High Strength and Related High Ductility in Nanotwinned Metals

MODELLING THE YIELD STRENGTH AND DUCTILITY IN COMPOSITE NANOTWINNED COPPER

Molecular Dynamics Investigation of Plastic Deformation Mechanism in Bulk Nanotwinned Copper with Embedded Cracks

A Constitutive Description of the Yield Strength and Strain Hardening Behaviors of Nano-Twinned Metals

Strengthening Mechanism of Ni–Cu Nanotwins with Void under Different Tensile Directions Based on Molecular Dynamics Simulation

Plastic deformation mechanism in nanotwinned metals: An insight from molecular dynamics and mechanistic modeling

Deformation and Failure Mechanisms of Nanotwinned Copper Films with A Pre-Existing Crack

On the Ductile Damage of Nanotwinned Copper Crystal with Prolate Void Defect at the Twin Boundary

Strengthening Mechanisms and Dislocation Processes in < 111 > Textured Nanotwinned Copper

Coupling Effect of Twin Boundary and Void on the Mechanical Properties of Bulk Nanotwinned Copper: an Atomistic Simulation

Deformation Twinning and Dislocation Processes in Nanotwinned Copper by Molecular Dynamics Simulations

Molecular Dynamics Simulation of the Interaction Between Nanoscale Twin Boundaries and Partial Dislocations

Atomistic Mechanisms of Fatigue in Nanotwinned Metals