Abstract:Ferroelectric MEMS (microelectromechanical systems) has been a growing area of research in past decades, in which ferroelectric films have been utilized for a variety of applications including microsensors and microactuators. For microactuator applications, thicker PZT films are preferred since generative force of the actuator increases with increasing film thickness. However, integration of 1 to 50 gm thick PZT films on silicon wafer, either the deposition or the patterning, is still a bottleneck in micromachining process. In this paper, a composite coating technique based on chemical solution deposition and high-energy ball milled powders has been employed to fabricate thick PZT films. Nanopowders ensure the uniformity of the film microstructure, whereas, it is crucial to make sure the primary added PZT powders possess good ferroelectric properties for the overall ferroelectric performance of the thick films. Micromachining of the integrated microactuators on silicon wafer using such thick films has been investigated. Diaphragm arrays with a thick PZT film have been demonstrated and the performances of these devices are reported. These integrated microactuators are essential elements of various MEMS devices, such as micropumps, microphone array and acoustic microspeaker array for audio beam application.

Mems Device Arrays Using Thick Composite Pzt Films