Tuning of Thermal and Dielectric Properties for Epoxy Composites Filled with Electrospun Alumina Fibers and Graphene Nanoplatelets Through Hybridization

Jun-Wei Zha,Tian-Xing Zhu,Yun-Hui Wu,Si-Jiao Wang,Robert K. Y. Li,Zhi-Min Dang
DOI: https://doi.org/10.1039/c5tc01552a
IF: 6.4
2015-01-01
Journal of Materials Chemistry C
Abstract:Epoxy resin is widely used for electrical and electronics packaging in various forms due to its excellent adhesion, low cure shrinkage and good electrical insulation.
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