Stretchable copper wires based on reduction of active metallic nanoparticles and electroplating

Zou Peichao,Liu Jingping,Yang Cheng
DOI: https://doi.org/10.1109/ICEPT.2015.7236647
2015-01-01
Abstract:Herein we proposed a novel technique in fabricating stretchable copper conductive circuits combining galvanic replacement with Zn-based active paste and electroplating process on elastomeric substrates. The conductive patterns exhibited excellent electrical conductivity and strechability. An active precursor paste composed of zinc nanoparticles and thermal-curable polyurethane resin were used, which was aimed to render the formation of copper layer as the conductive materials by a galvanic replacement reaction. Additionally, electroplating process was employed, with which the as-formed copper layer can be further thickened to improve the electrical conductivity. With this method, a maximal longitudinal tensile elongation of 38.4% was achieved for the wires with negligible conductivity loss. In summary, the flexible copper-based conductive circuits with excellent performances were produced in a cost-effective way. This technology will be a promising candidate for future stretchable electronic applications.
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