Disassembly Sequence Planning of Product Structure With an Improved QICA Considering Expert Consensus for Remanufacturing
Yixiong Feng,Kaiyue Cui,Zhaoxi Hong,Zhiwu Li,Weiyu Yan,Jianrong Tan
DOI: https://doi.org/10.1109/tii.2022.3231922
IF: 12.3
2023-05-05
IEEE Transactions on Industrial Informatics
Abstract:Planning a disassembly sequence of product structure in a remanufacturing-oriented manner is a newly emerging and important problem, which has attracted considerable attention owing to high demand for sustainable development. However, current approaches cannot lead to a reliable disassembly plan focused on the product structure itself, starting from functional properties to application demand stimulated by remanufacturing. First, they fail to focus on the role that EOL products play in the promotion of remanufacturing. Second, determining a disassembly solution for advanced and sophisticated products is complicated and time-consuming. Third, the uncertainty of mixed information triggered by the intercrossing of multiple subjects is neglected. In this study, an improved DSP method is first proposed by integrating the remanufacturing properties of EOL products, an improved QICA, and the measure and update of the reliability of experts' decision-making to perform DSP. The functional recoverability of EOL product parts is marked to identify the remanufacturing value of a disassembly plan. The expected reproduction probability is adopted to increase the population diversity and improve the ability of QICA to search for feasible solutions. The model and update mechanism of experts' recognition degree are constructed to narrow the score deviation. Finally, we provide a case for a sewing machine to verify the superiority of the improved QICA. The results show that it is capable of obtaining satisfactory solutions and outperforms the quantum genetic algorithm and particle swarm optimizer.
automation & control systems,computer science, interdisciplinary applications,engineering, industrial