Prediction of a New Leveler (N-Butyl-methyl Piperidinium Bromide) for Through-Hole Electroplating Using Molecular Dynamics Simulations

Chong Wang,Maozhong An,Peixia Yang,Jinqiu Zhang

DOI: https://doi.org/10.1016/j.elecom.2012.02.028

IF: 5.443

2012-01-01

Electrochemistry Communications

Abstract:Adsorption behaviors of N-butyl-methyl piperidinium bromide (PP14Br) at Cu (001) surface under different electric fields were investigated using molecular dynamics (MD) simulations. We predicted PP14Br could be used as a new leveler for through-hole copper electroplating. In the through-hole electroplating experiments, PP14Br was employed as a leveler. The results of electroplating confirmed the prediction. The electrochemical tests were characterized by potentiodynamic polarization and galvanostatic measurements using rotating disk electrode operated at 100 and 1000rpm.