Metal-Free Csp3–N Bond Cleavage of Amides Using Tert-Butyl Hydroperoxide As Oxidant

Shengmei Guo,Zheng Zhu,Lin Lu,Wenbiao Zhang,Jiuhan Gong,Hu Cai
DOI: https://doi.org/10.1055/s-0034-1379879
2015-01-01
Synlett
Abstract:A mild and efficient protocol for the metal-free C-N bond-cleavage of amides has been developed. The methodology employs iodine as a catalyst to cleave the C(Me)-N bond of dimethylformamide or dimethylacetamide, providing novel access to methylene-bridged bis-1,3-dicarbonyl compounds instead of enol carbamates in the presence of tert-butyl hydroperoxide.
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