Abstract:Accurate measurement of critical strain and stress of a thin film when it fractures is crucial during testing of fracture toughness. In microbridge testing method, tensile displacement of a film is in consistent with the crack opening distance (COD) of substrate pre-crack at position where it anchors. However, a mathematical model for COD is difficult to deduce in mechanics due to the complex mechanical condition cause by the non half infinite boundary and the existence of an arresting hole near crack tip. High resolution scanning electron microscope (HR-SEM) is used to examine the COD of substrate pre-crack. Both of the opening distance (delta(s1)) at crack end and the opening distance (delta(s2)) at the edge of arresting hole were accurately measured. Results show that delta(s1) and delta(s2) varies linearly when delta(s1) is in range of 9 similar to 35 mu m. A stationary virtual crack tip was then hypothesized so that a linear relationship of COD of substrate pre-crack was subjected. Film tensile displacement can then be easily determined according to delta(s1) and the position the film anchored. A mathematical mode for fracture toughness of a film was derived via superposition of uni-axial tensile stress and the pure bending stress the film endured during tensile testing. A test for CuZr amorphous thin film was carried out, and 1. 08 similar to 1. 70 MPa.m(1/2) of K-IC is obtained. Results reveal that test values of K-IC vary with the length of the pre-crack on film specimens (a/W) , which may be resulted from the stain softening of amorphous metallic glass.

Brittle Film-Induced Cracking of Ductile Substrates

Cleavage Cracking of Ductile-Metal Substrates Induced by Brittle Coating Fracture

Discontinuous Cracking of TiN Films on a Steel Substrate Induced by an Adhesive Interlayer

Externally Applied Stress Sign and Film Elastic Properties Effects on Brittle Film Fracture

Fracture Mechanism of Metallic Film with Nano to Sub-Micron Thickness on Polycrystalline Substrate

Substrate Slip Steps Promote Cracking and Buckling of Thin Brittle Film

Competing mechanisms in fracture of amorphous films resting on ductile substrates

In situ observation of intergranular fracture propagation in nanocrystalline freestanding ultrathin tungsten film

Linear Opening Model of Substrate Pre-crack and Determination of Fracture Strain of Thin Film during Tensile Testing of Microbridge Method

Comparison of Cracking Behavior of Nanocrystalline Cu Film on Substrates of Different Plastic Deformation Mechanisms

Multiple cracking of thin films due to residual stress combined with bending stress

Analysis on the Cracking of Thin Hard Films Considering the Effects of Interfacial Delamination

Cracking of NiTi Thin Films Deposited on Cu Substrate

Crack Evolution in Diamond-Like Carbon Films on Steel Substrates During Nano-Indentation

Damage Evolution and Ductile Fracture Prediction During Tube Spinning of Titanium Alloy

The estimation of residual stresses by the brittle thin film’s initial cracks on a ductile substrate subjected to tensile stresses

Peridynamic Fracture Analysis of Film–substrate Systems

Effect of residual stresses on the strength and fracture energy of the brittle film: Multiple cracking analysis

Annealing Improved Ductility and Fracture Toughness of Nanocrystalline Cu Films on Flexible Substrates

Prediction of ductile cracking in the titanium alloy forging process

Dynamic meshing force and blunt effects on atomistic scale ductile-brittle behavior of the crack in bcc iron