Package Compatibility and Substrate Dependence of Granular Soft Magnetic Material CoFeHfO Developed by Reactive Sputtering

Liangliang Li,Shan X. Wang,Kyu-Pyung Hwang,Yongki Min,Ming Mao,Thomas Schneider,Randhir Bubber
DOI: https://doi.org/10.1063/1.2158973
IF: 2.877
2006-01-01
Journal of Applied Physics
Abstract:Integration of magnetic passive components into package has been attracting more interests recently, but efficient package-compatible magnetic materials are needed. We have developed a package-compatible granular material, CoFeHfO, on a printed circuit board by reactive sputtering and investigated the substrate dependence of its soft magnetic property. Atomic force microscopy and grazing incidence x-ray-scattering-diffraction spectra show that a rough substrate surface degrades the magnetic property of CoFeHfO thin films with almost the same crystal microstructure. With surface planarization by chemical-mechanical polishing, soft magnetic material CoFeHfO can be realized on the package substrate. This material is promising for future applications in package.
What problem does this paper attempt to address?