Abstract:In the pursuit of effective thermal management for electronic devices, it is crucial to develop insulation thermal interface materials (TIMs) that exhibit exceptional through-plane thermal conductivity, low thermal resistance, and minimal compression modulus. Boron Nitride (BN), given its outstanding thermal conduction and insulation properties, has garnered significant attention as a potential material for this purpose. However, previously reported BN-based composites have consistently demonstrated through-plane thermal conductivity below 10 W m -1 K -1 and high compression modulus, whilst also presenting challenges in terms of mass production. In this study, low molecular weight polydimethylsiloxane (PDMS) and large-size BN were utilized as the foundational materials. Utilizing a rolling-curing integrated apparatus, we successfully accomplished the continuous preparation of large-sized, high-adhesion BN films. Subsequent implementation of stacking, cold pressing, and vertical cutting techniques enabled the attainment of a remarkable BN-based TIM, characterized by an unprecedented through-plane thermal conductivity of up to 12.11 W m -1 K -1 , remarkably low compression modulus (55 kPa), and total effective thermal resistance (0.16 o C in 2 /W, 50 Psi). During the TIMs performance evaluation, our TIMs demonstrated superior heat dissipation capabilities compared with commercial TIMs. At a heating power density of 40 W/cm 2 , the steady-state temperature of the ceramic heating element was found to be 10 °C lower than that of the commercial TIMs. This pioneering feat not only contributes valuable technical insights for the development of high-performance insulating TIMs but also establishes a solid foundation for widespread implementation in thermal management applications across a range of electronic devices.

Highly thermally conductive and soft thermal interface materials based on vertically oriented film

Highly Thermally Conductive and Soft Thermal Interface Materials Based on Vertically Oriented Boron Nitride Film

Highly oriented BN-based TIMs with high through-plane thermal conductivity and low compression modulus

A Novel Thermal Interface Material Composed of Vertically Aligned Boron Nitride and Graphite Films for Ultrahigh Through-Plane Thermal Conductivity

Enhanced Through-Plane Thermal Conductivity and High Electrical Insulation of Flexible Composite Films with Aligned Boron Nitride for Thermal Interface Material

Design of Silicon Rubber/BN Film with High Through-plane Thermal Conductivity and Ultra-low Contact Resistance

Isotropically Ultrahigh Thermal Conductive Polymer Composites by Assembling Anisotropic Boron Nitride Nanosheets into a Biaxially Oriented Network.

Spherical Boron Nitride/silicone Rubber Composite with High Isotropic Thermal Conductivity Via Pre‐constructing Thermally Conductive Networks

Vertically Aligned Boron Nitride Nanosheets Films for Superior Electronic Cooling

Vertically Aligned and Interconnected Boron Nitride Nanosheets for Advanced Flexible Nanocomposite Thermal Interface Materials

Vitrimer-Assisted Construction of Boron Nitride Vertically Aligned Nacre-mimetic Composites for Highly Thermally Conductive Thermal Interface Materials

Stable self-crosslinking phase change composites with vertically aligned boron nitride for high thermal conductivity thermal interface materials

Interacted boron nitride/Mxene hybrids with vertically aligned networks for improving the thermal conductivity, electromagnetic wave absorption and mechanical properties for the polymer-based thermal interface materials

Facile preparation of thermally conductive fiber film by self‐assembling interconnected boron nitride nanosheets for effective thermal interface materials

Superior Thermal Interface Materials for Thermal Management

Highly Thermally Conductive Composites with Boron Nitride Nanoribbon Array

A highly thermally conductive yet electrically insulating boron nitride nanosheets/polyetherimide composite with oriented structure

Flexible, Thermally Conductive, Electrically Insulated, and High-Temperature Resistant PDMS@BN Composite Films with High Orientation Degree of BN Sheets Prepared by Facile Spin-Coating

A Full-component recyclable Epoxy/BN thermal interface material with anisotropy high thermal conductivity and interface adaptability

Dielectric Polymer Nanocomposite with Interconnected Boron Nitride Nanosheets for Thermal Management Application

Transposable, highly thermal conductive silicone rubber/boron nitride composites with enhanced orientation of BN by multilayer stacked hot pressing according to rheological control