A batch-filling method of VIE-MoM matrix for inhomogeneous dielectric target with full- and half-SWG function

Ruqi Xiao,Wen Geyi,Guo Yang,Wen Wu
DOI: https://doi.org/10.1016/j.enganabound.2024.03.012
IF: 3.25
2024-03-09
Engineering Analysis with Boundary Elements
Abstract:A batch-filling method (BFM) for generating the volume-integral-equation-methods of moment (VIE-MoM) matrix for the scattering of inhomogeneous objects by using the full- and half-SWG basis function is proposed. The BFM is based on the summation of contributions of all integrals over tetrahedrons and boundary faces, and the contributions are arranged into a column vector that represents the interactions of the source basis function with all the test basis functions. The time of the BFM for filling VIE-MoM matrix can be reduced over 95% compared with the conventional basis-basis (CBB) matching filling scheme due to the vector filling scheme, which avoids the repeated traversal between the source tetrahedron and test tetrahedron to fill the impedance matrix elements. Details for the numerical process and the filling scheme of impedance matrix are elaborated. Numerical results show that the batch-filling method has high computational efficiency and accuracy for VIE-MoM.
engineering, multidisciplinary,mathematics, interdisciplinary applications
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