3D Lamellar-Structured Graphene Aerogels for Thermal Interface Composites with High Through-Plane Thermal Conductivity and Fracture Toughness
Pengfei Liu,Xiaofeng Li,Peng Min,Xiyuan Chang,Chao Shu,Yun Ding,Zhong-Zhen Yu
DOI: https://doi.org/10.1007/s40820-020-00548-5
2020-11-11
Abstract:<span class="a-plus-plus abstract-section id-a-sec1"><h3 class="a-plus-plus"> Highlights</h3><ul class="a-plus-plus"><li class="a-plus-plus"><p class="a-plus-plus">Lamellar-structured graphene aerogels with vertically aligned and closely stacked high-quality graphene lamellae are fabricated.</p></li><li class="a-plus-plus"><p class="a-plus-plus">The superior thermally conductive capacity of the aerogel endows epoxy with a high through-plane thermal conductivity of 20.0 W m<sup class="a-plus-plus">−1</sup> K<sup class="a-plus-plus">−1</sup> at 2.30 vol% of graphene content.</p></li><li class="a-plus-plus"><p class="a-plus-plus">The nacre-like structure endows the epoxy composite with enhanced fracture toughness.</p></li></ul></span><span class="a-plus-plus abstract-section id-a-sec2"><p class="a-plus-plus">Although thermally conductive graphene sheets are efficient in enhancing in-plane thermal conductivities of polymers, the resulting nanocomposites usually exhibit low through-plane thermal conductivities, limiting their application as thermal interface materials. Herein, lamellar-structured polyamic acid salt/graphene oxide (PAAS/GO) hybrid aerogels are constructed by bidirectional freezing of PAAS/GO suspension followed by lyophilization. Subsequently, PAAS monomers are polymerized to polyimide (PI), while GO is converted to thermally reduced graphene oxide (RGO) during thermal annealing at 300 °C. Final graphitization at 2800 °C converts PI to graphitized carbon with the inductive effect of RGO, and simultaneously, RGO is thermally reduced and healed to high-quality graphene. Consequently, lamellar-structured graphene aerogels with superior through-plane thermal conduction capacity are fabricated for the first time, and its superior through-plane thermal conduction capacity results from its vertically aligned and closely stacked high-quality graphene lamellae. After vacuum-assisted impregnation with epoxy, the resultant epoxy composite with 2.30 vol% of graphene exhibits an outstanding through-plane thermal conductivity of as high as 20.0 W m<sup class="a-plus-plus">−1</sup> K<sup class="a-plus-plus">−1</sup>, 100 times of that of epoxy, with a record-high specific thermal conductivity enhancement of 4310%. Furthermore, the lamellar-structured graphene aerogel endows epoxy with a high fracture toughness, ~ 1.71 times of that of epoxy. </p></span>
materials science, multidisciplinary,physics, applied,nanoscience & nanotechnology