A Copper-Formate Framework Showing A Simple to Helical Antiferroelectric Transition with Prominent Dielectric Anomalies and Anisotropic Thermal Expansion, and Antiferromagnetism

Ran Shang,Sa Chen,Zhe-Ming Wang,Song Gao
DOI: https://doi.org/10.1002/chem.201403466
2014-01-01
Chemistry - A European Journal
Abstract:We present here the compound [NH4][Cu(HCOO) 3], a new member of the [NH4][M(HCOO) 3] family. The JahnTeller Cu2+ ion leads to a distorted 4(9) 6(6) chiral Cu-formate framework. In the low-temperature (LT) orthorhombic phase, the Cu2+ is in an elongated octahedron, and the NH_4 ions in the framework channel are off the channel axis. From 94 to 350 K the NH4- ion gradually approaches the channel axis and the related modulation of the framework and the hydrogen- bond system occurs. The LT phase is simple antiferroelectric (AFE). The material becomes hexagonal above 355 K. In the high-temperature (HT) phase, the Cu2+ octahedron is compressed, and the NH_4 ions are arranged helically along the channel axis. Therefore, the phase transition is one from LT simple AFE to HT helical AFE. The temperature-dependent structure evolution is accompanied by significant thermal and dielectric anomalies and anisotropic thermal expansion, due to the different status of the NH4- ions and the framework modulations, and the structure-property relationship was established based on the extensive variable-temperature single-crystal structures. The material showed long range ordering of antiferromagnetism (AFM), with low dimensional character and a N el temperature of 2.9 K. Therefore, within the material AFE and AFM orderings coexist in the low-temperature region.
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