Abstract:It is well-known that both Performance and reliability of present-day RF integrated circuits (RFICs & MMICs) and even Nano electronic devices cannot be completely understood or accurately predicted from electromagnetic considerations alone. For example, the performance parameters, such as S-parameters, power handling capability and breakdown thresholds of high-density nano interconnects and RF modules are often affected by heat conduction and mechanical stresses/deformations, in extreme cases leading to electro-thermo-mechanical breakdown. Under such circumstances, predictive simulations must rely on multiphysics computational approaches as opposed to electromagnetics-only methods. There exist many challenges in developing computational algorithms for rapidly and accurately analyzing electro-thermal and electro-thermo-mechanical phenomena in RF as well as nano electronic components and circuits with complex geometries and new material properties. Most material parameters involved, such as carrier mobility, permittivity, permeability, electrical conductivity, thermal conductivity, and thermal expansion coefficients are applied field, temperature, and thermal stress dependent. On the other hand, there exist significant differences in length and time scales among electrical, thermal, and mechanical field actions. Therefore, special attention must be paid to the choice of spatial discretization and time stepping procedures to ensure convergent multiphysics solutions. This talk will address challenges and opportunities in computational multiphysics method and its application for RF and Nano electronics, with a series of examples given and demonstrated for the capability of time-domain finite element method and its implementation.

Accurate Numerical Analysis of Nonlinearities Caused by Multipactor in Microwave Devices

Accurate Numerical Method for Multipactor Analysis in Microwave Devices

Statistical Computation for Multipactors in Arbitrary Microwave Devices

A Stabilized Numerical Scheme to Simulate Synergistic Effect of TID and TDR in Semiconductor Devices

Characterization of Mutual Coupling Effects among Multi-Antennas Mounted on a Perfect Electrically Conducting (PEC) Tower Platform in the Presence of Intentional Electromagnetic Pulses (Iemps)

Effective Numerical Simulations of Multipactor by WBPAT Theory

Perfectly Matched Layer Implementation Using Bilinear Transform for Microwave Device Applications

Monte Carlo Analysis of Occurrence Thresholds of Multicarrier Multipactors

Lumped-Network FDTD Method for Simulating Transient Responses of RF Amplifiers Excited by Intentional Electromagnetic Interference Signals

Multicarrier Multipactor Analysis Based on Branching Levy Walk Hypothesis

A Novel Numerical Model for Simulating Three Dimensional MIMO Channels With Complex Antenna Arrays

Investigation on Time- and Frequency-Domain Responses of Some Complex Composite Structures in the Presence of High-Power Electromagnetic Pulses

Computational Multiphysics Method for Rf and Nano Electronics: Challenges and Opportunities

TD-AIM-MOD method for simulating large-scale electromagnetic transients

Hybrid Time-Domain Adaptive Integration Method for Simulating Transient Electromagnetic Responses of an Arbitrary Structure with Large Scale

A Convolutional Perfect Matched Layer (CPML) for One-Step Leapfrog ADI-FDTD Method and Its Applications to EMC Problems

Impact of Nonlinear Effects on the Silicon-Based Waveguides and Microring Resonators

Conformal FDTD method for simulating the interaction of an EMP with multiple PEC/dielectric wedge structures

Localization of Passive Intermodulation Based on the Concept of $k$ -Space Multicarrier Signal

2D Pim Simulation Based on Comsol

Investigation on Multipactor in Double-Sided Dielectric-Loaded Microwave Components