Study on tensile properties of copper/graphene/2D-SiC composite materials: A molecular dynamics simulation

Qingshan Wang,Lei Wang,Yandong Wu
DOI: https://doi.org/10.1016/j.mtcomm.2024.109512
IF: 3.8
2024-06-16
Materials Today Communications
Abstract:Van der Waals heterostructures composed of graphene and 2D-SiC generally exhibit outstanding electrical and mechanical properties. However, these structures are prone to brittle failure during damage, which greatly limits their application in practical engineering. Conversely, copper-based composite materials have been discovered to significantly enhance material toughness. Therefore, a novel copper/graphene/2D-SiC composite material is designed and molecular dynamics simulation is performed to investigate its mechanical properties under uniaxial tension. The results show that these composite materials possess the advantages of both high strength and toughness due to the heterostructure layer and the copper layer. Further analysis of the deformation mechanism of the copper layer indicates that it is mainly attributed to short-range atomic slip and the generation of Shockley partial dislocations. The heterostructure layer can partially impede the propagation of dislocations, enhancing the overall tensile strength of the composite materials. After the copper layer enters the plastic flow state, the variation of bond lengths and bond angles suggests that the heterostructure layer bears the tensile load, and the 2D-SiC layer is more prone to fracture due to higher stiffness compared to the graphene layer. Additionally, the influence of temperature and strain rate on the tensile properties is investigated. It is observed that increasing temperature could gradually reduce the tensile strength of the composite materials while the strain rate, within a certain range, has little effect.
materials science, multidisciplinary
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