Guest Editorial Solid and Physical Modeling.

Shi-Min Hu,Bruno Lévy,Dinesh Manocha
DOI: https://doi.org/10.1109/tase.2009.2022974
2009-01-01
Abstract:This special section contains improved and extended versions of six selected presentations at the ACM Symposium on Solid and Physical Modeling and Applications (ACM SPM), held in Beijing, China, from June 4 to 6, 2007.
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