Investigation of grooved surface suppressing multipactor across HPM dielectric window

baipeng song,haibao mu,guanjun zhang,zhuangzhuang fan,chunliang liu,meiyou shi,yong liao
DOI: https://doi.org/10.1109/DEIV.2014.6961628
2014-01-01
Abstract:Microwave breakdown phenomenon across dielectric window at the vacuum/dielectric interface limits the transmission of HPM and becomes a bottleneck of HPM technology development. Its avoidance or suppression is a major concern among researchers on HPM sources. Currently, the most effective approach is geometrical modification with the goal of altering the trajectories of electrons. In this paper, periodic rectangular grooves perpendicular to microwave electric field, are applied to improve the threshold of breakdown. To clarify the mechanism, the SEEA simulation model based on dynamic analysis and particle-in-cell (PIC) is built in this paper. The grooves change the electrons trajectories and eventually resonant multipactor condition may no longer be satisfied. The suppression effect is influenced by the grooves and each given width relates to an effective power range for suppression. Dielectric breakdown experiments under HPM of S-band at 2.86 GHz are conducted with the grooved dielectric window. The results of the experiment are consistent with theoretical analysis and simulation.
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