Abstract:Recently, with the increasing requirements on guaranteeing the color uniformity and improving the luminous efficacy and manufacturing efficiency, a wafer level chip scale packaging (WLCSP) technology has been developed by thermally impressing a thin multiple phosphor film on a LED wafer, then being segmented into individual LED chips. In this paper, a high power white LED Chip-on-Board (COB) module with high color rendering index (CRI, $\mathbf{Ra} > 93)$ and tunable correlated color temperatures (CCTs) is prepared. In this COB module, the tunable color temperatures are achieved by using two types of white LED WLCSPs with different target CCTs of 3000K and 5000K, and twelve CSPs are mounted in series with the flip-chip soldering technology. The thermal dissipation effect and luminescence mechanism of this COB module are studied through the finite element analysis (FEA) and Monte-Carlo Ray-tracing simulations respectively. The results reveal that: firstly, the measured spectral power distribution (SPD) intensity of the prepared COB module are smaller than the arithmetic sum of SPD intensities of its each series connected CSPs, which may be attribute to the light absorption happened among CSPs. Secondly, the case temperature and driven current have the different effects on the optical and color performances of COB module (such as luminous flux, CCT and CRI).

Effect of Patterned Substrate on Light Extraction Efficiency of Chip-on-board Packaging LEDs

Design of Optical Structure for Chip-on-board Wafer Level Packaging LEDs

A Facile Approach to Fabricate Patterned Surfaces for Enhancing Light Efficiency of COB-LEDs

A Cylindrical Tuber Encapsulant Geometry for Enhancing Optical Performance of Chip-on-Board Packaging Light-Emitting Diodes

Effect of Refractive Index of Packaging Materials on the Light Extraction Efficiency of COB-LEDs with Millilens Array.

Enhancement of Light Extraction of Multi-Chips Light-Emitting Diode (LED) Modules with Various Micro-Structure Arrays

The Transmission Modulation Effect of Patterns on the Light Extraction of Ultraviolet-C Light Emitting Diodes

A sandwich structure of multi-chip COB LED with double flat glass boards coated with phosphors film by screen printing technique

Effects of Phosphor’s Location on LED Packaging Performance

Effects of Packaging Structure on Optical Performances of Phosphor Converted Light Emitting Diodes

Realization of Microlens Array on Flat Encapsulant Layer for Enhancing Light Efficiency of COB-LEDs

Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for Chip-on-Board Light-Emitting Diodes Packaging

A new substrate for realizing hemispherical encapsulant layer to enhance light efficiency of light-emitting diodes

Effect of the Substrate Temperature on the Phosphor Sedimentation of Phosphor-Converted LEDs

Effect of the amount of phosphor silicone gel on optical property of white light-emitting diodes packaging

Modeling the Light Extraction Efficiency of Bi-Layer Phosphors in White LEDs

Enhanced Light Extraction Efficiency of an LED Package by a Surface-Mounted Amorphous Photonic Structure

Luminescence mechanism analysis on high power tunable color temperature Chip-on-Board white LED modules

Combined Experimental and Monte-Carlo Ray-Tracing Approach for Optimizing Light Extraction in LED COB Modules

Optical Analysis of Phosphor's Location for High-Power Light-Emitting Diodes

An Improved Substrate Structure for High Angular Color Uniformity of White Light-Emitting Diodes