Abstract:Interconnection plays an important role in performance and power of CMP designs using deep sub-micron technology. The network-on-chip (NoCs) has been proposed as a scalable and high-bandwidth fabric for interconnect design. The advent of the 3D technology has provided further opportunity to reduce on-chip communication delay. However, the design of the 3D NoC topologies has important distinctions from 2D NoCs or off-chip interconnection networks. First, current 3D stacking technology allows only vertical inter-layer links. Hence, there cannot be direct connections between arbitrary nodes in different layers — the vertical connection topology are essentially fixed. Second, the 3D NoC is highly constrained by the complexity and power of routers and links. Hence, low-radix routers are preferred over high-radix routers for lower power and better heat dissipation. This implies long network latency due to high hop counts in network paths. In this paper, we design a low-diameter 3D network using low-radix routers. Our topology leverages long wires to connect remote intra-layer nodes. We take advantage of the start-of-the-art one-hop vertical communication design and utilize lateral long wires to shorten network paths. Effectively, we implement a small-to-medium sized clique network in different layers of a 3D chip. The resulting topology generates a diameter of 3-hop only network, using routers of the same radix as 3D mesh routers. The proposed network shows up to 29% of network latency reduction, up to 10% throughput improvement, and up to 24% energy reduction, when compared to a 3D mesh network.

Incremental design of scalable wireless interconnection structure for CMPs

A Hybrid Chip Interconnection Architecture with a Global Wireless Network Overlaid on Top of a Wired Network-on-chip

An Exploration on Quantity and Layout of Wireless Nodes for Hybrid Wireless Network-on-Chip

Scalable Connection-Based Time Division Multiple Access Architecture for Wireless Network-on-Chip.

A Scalable Methodology for Designing Efficient Interconnection Network of Chiplets

A new topology for system-on-chip design

Topology and Mapping Co-Design for Complex Communication Systems on Wireless NoC Platforms

A Traffic-Aware Adaptive Routing Algorithm on A Highly Reconfigurable Network-On-Chip Architecture

UniMESH: the Light-Weight Unidirectional Channel Network-on-Chip in 2D Mesh Topology

Power-Aware Run-Time Incremental Mapping For 3-D Networks-On-Chip

A Reconfigurable 2D-Mesh NoC Design with Agile Development Technique of SpinalHDL

Scalability of UWB Cognitive Radio Networks with Interference Constraint

Multi-mapping Meshes: A New Communicating Fabric for Networks-on-Chip

Co-Design of Topology and Mapping for Wireless NoC Platform

A novel 3D NoC architecture based on De Bruijn graph

Whole packet forwarding: Efficient design of fully adaptive routing algorithms for networks-on-chip

Topological Structure and Physical Layout Co-design for Wavelength-Routed Optical Networks-on-Chip

A Subnetting Mechanism with Low Cost Deadlock-Free Design for Irregular Topologies in NoC-based Manycore Processors

A Heuristic Mapping Approach for Wormhole Switching Based Network-On-Chip

Incremental 3D NoC synthesis based on physical-aware router merging algorithm

A Low-Radix and Low-Diameter 3d Interconnection Network Design