The Application of the F685/F730 Ratio of Delayed Fluorescence Spectrum Temperature Curve in Heat Tolerance Evaluation

LI Ying,XU Wen-hai,DONG Li-li,XING Da
DOI: https://doi.org/10.3788/fgxb20113201.0094
2011-01-01
Abstract:In order to obtain the relationship between temperature-stress and delayed fluorescence(DF) emission spectra,in this paper,three different heat-resistant maizes were used as samples to experimentally study the plant DF emission DF spectra at different elevated temperatures(10~50 ℃).The experimental spectra were obtained by 660 nm excitation.Results showed that there are two distinct emission peaks in DF spectra,that is,the main peak at around 685 nm and the second peak at around 730 nm.The maximal values of DF emission spectra at 685 nm and 730 nm were marked as F685 and F730,respectively.The experimental results illustrated that the F685/F730 ratio varied with the increase of temperature.It was also found that the F685/F730 ratio at 10 ℃and 50 ℃,which was marked as V10 and V50,respectively,are obviously different.The V10/V50 ratio depended on the heat-resisting property of the samples.These results indicated that the higher the heat-resisting property of the sample is,the lower the V10/V50 ratio is.Additionally,the longer temperature stress time is,the lower V10/V50 ratio is.Hence,we concluded that DF emission spectra vary with the temperature-stress,and the response curve of F685/F730 ratios of different samples display a similar law.Moreover,the responses of F685/F730 ratio of DF emission spectra to the temperature for the different heat-resistant Maize samples could be a new and useful judgment to identify and evaluate the heat-resisting property of maize.
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