Abstract:Pb-free solders are gaining ground as the optimum choice for electrical interconnect materials, however, their higher melting temperature around 217 °C is still an issue that restricts wider adoption. The potential to employ Bi substitution for Sn to lower solder joint processing temperatures has been widely considered. In this work, the mechanical properties of eutectic SAC with gradually increasing Bi substitution up to 10 wt% Bi was studied. It is shown that fracture strength ( increases with Bi additions from 50 MPa plateauing at 60 MPa between 1.4 and 1.8% Bi which represents the limits of solid solution strengthening. Over this substitutional range, strain at fracture ( dropped from 30 to 10% which was also evidenced by smaller percentage reduction in area (%RA). The was nearly 80 MPa for 2% Bi increasing gradually with increasing Bi concentrations and peaking at 93 MPa for 7% Bi whilst maintaining 10% elongation at fracture. X-ray diffraction and DSC thermal studies suggests that the solubility limit of Bi in -Sn (in the multicomponent SAC) is less than 2 wt% Bi. With the aid of small-angle neutron Scattering (SANS) and ultra-small-angle neutron scattering (USANS), it was found that the scattering intensity changes for alloys with Bi content in the range 0.8 – 1.5wt% compared to ternary SAC with less than 0.8% Bi at low scattering factors (Q > ) signifying microstructural differences at length scales of the order of 10–100 nm. There were no differences observed in scattering for alloy samples with more than 2 wt% Bi.<svg xmlns="http://www.w3.org/2000/svg" style="display: none;"><defs id="MathJax_SVG_glyphs"></defs></svg>

Investigation of Preparation and Characteristics of Sn–Bi Eutectic Powders Derived from a High Shear Mechanical Approach

Deformation mechanism of various Sn-xBi alloys under tensile tests

Effects of endogenous Al and Zn phases on mechanical properties of Sn58Bi eutectic alloy

Thermodynamic Properties and Phase Equilibria of Sn–Bi–Zn Ternary Alloys

Microstructure changes in Sn-Bi solder joints reinforced with Zn@Sn particles in thermal cycling and thermomigration

Fabrication and characterization of Sn-57 wt% Bi film by pulse DC current co-electrodeposition and reflow

A Study of Sn-Bi Alloy Electrodepositing Process

The Effect of In Concentration and Temperature on Dissolution and Precipitation in Sn–Bi Alloys

Fabrication of BiInSn alloy powder via the combination of ultrasonic crushing with dispersants

Research on Lamellar Structure and Micro-Hardness of Directionally Solidified Sn-58bi Eutectic Alloy

Effects of Bi Doping on Zn-Rich Phase Evolution and Physical and Chemical Properties of Sn-6.5Zn Lead-Free Solder Alloy

Phase Transformations and Mechanical Properties in In–Bi–Sn Alloys as a Result of Low-Temperature Storage

Reducing anisotropy of rhombohedral Bi-rich phase for high-performance Ag-alloyed Sn–Bi low-temperature solders

A Study On The Effect Of Ultrasonic Treatment On The Microstructure Of Sn-30 Wt.% Bi Alloy

Investigating the preferential growth of Bi grains in Sn-Bi based solder under thermal aging

Thermodynamic Assessment of Molten Bix-Sn1−x (x = 0.1 to 0.9) Alloys and Microstructural Characterization of Some Bi-Sn Solder Alloys

Investigation of Microstructure and Thermo-stability of Ag-cu-sn Filler Metal Powders Prepared by Mechanical Alloying

Microstructure evolution of Cu-Sn-Bi alloy in ball milling and sintering

Spreading Dynamics and Interfacial Characteristics of Sn-3.0Ag-0.5Cu-xBi Melting on Cu Substrates

The effects of Bi substitution for Sn on mechanical properties of Sn-based lead-free solders

Sn–Bi–Fe Thermodynamic Modeling and Sn–Bi/Fe Interfacial Reactions