Viscosity and Thermal Conductivity of Alumina Microball/epoxy Composites

Hui Yu,Liangliang Li,Longhao Qi

DOI: https://doi.org/10.1109/icept.2011.6066859

2011-01-01

Abstract:Filling ceramic particles that exhibit high thermal conductivity into a polymer is an effective way to enhance the thermal conductivity of the polymer. Alumina (Al2O3) microballs were chosen as the fillers to confirm whether their super-spherical structure would enlarge the maximum filling content of the filler into the polymer matrix. The impacts of Al2O3 microballs on the thermal conductivity of the composites and the viscosity of pre-curing suspension were investigated. The viscosity increased slightly when a 20 vol. % of Al2O3 microballs were filled, and when the filling content reached 50 vol. %, the viscosity was still relatively lower than that of the epoxy with roughly spherical AlN granules. A high thermal conductivity of 2.70 W/(m·K) was achieved with an Al2O3 microball content of 60 vol. %.