Abstract:Abstract Miniaturization of electronics modules is always required for various medical applications including wearable technology, such as hearing aids, and implantable devices. Many types of high-density packaging technologies, such as package-on-package, bare-die stack, flex folded package and Through Si Via (TSV) technologies, have been proposed and used to fulfill the request. Among them, embedded die technology is one of the promising technologies to realize miniaturization and high-density packaging. We have developed WABETM (wafer and board level device embedded) technology for embedding dies into multilayer flexible printed circuit (FPC) boards. The WABE package is comprised of thin dies (85 μm thickness), multi-layer polyimide, adhesive films and conductive paste. The dies are sandwiched by polyimide films with Cu circuits (FPCs). The conductive paste provides electrical connections between the layers as well as the layer and embedded die. First, each FPC layer is fabricated individually, and via holes are filled with conductive paste, and the dies are mounted on certain layers. Then, all layers undergo a one-step co-lamination process, and they are pressed to cure the adhesive material and conductive paste at the same time. This WABE technology has enabled multiple dies to be embedded by the one-step lamination process. Even if multiple dies are embedded, the footprint of a package can be reduced drastically by embedding multiple dies vertically in stacks. This paper describes the details of the results of fabricating a test vehicle with six embedded dies (three-dies in two stacks side-by-side). The fabricated test vehicle had 14 copper layers with less than 0.9 mm thickness. This paper also reports the results of various reliability testing on the package. These results were obtained by electrical measurements of daisy chain patterns formed between some of the layers. The fabricated test vehicle showed high reliability based on the results of a moisture and heat test and heat-shock test. These results show that the WABE technology to embed multiple dies vertically in polyimide film is one of the most promising packaging technologies to significantly miniaturize electronic circuits such as medical electronics.

Printed circuit board electrical design for wafer-level packaging

Methods and designs for improving the signal integrity for 3D electrical interconnects in high performance IC packaging

Tightly-integrated chip packaging structure and phased array radio frequency transceiving device formed by tightly-integrated chip packaging structure

SEMICONDUCTOR PACKAGE STRUCTURE HAVING MICRO-ISOLATION CAVITY

Novel Millimeter-Wave Power Combining Utilizing Wafer Level Packaging Technology

A Pcb-Based Package Structure

Recent Advances and Trends in Advanced Packaging

Reliability challenges and design considerations for Wafer-Level packages

A Novel Packaging Method Using Flexible Printed Circuit Board for High-Frequency SiC Power Module

Improvement of Thermo-Mechanical Reliability of Wafer-Level Chip Scale Packaging

Cascaded Microwave Network Approach for Power and Signal Integrity Analysis of Multilayer Electronic Packages

Study of Warpage Evolution and Control for Six-Side Molded WLCSP in Different Packaging Processes

Advanced Packaging Design Platform for Chiplets and Heterogeneous Integration

Fan-Out Panel-Level PCB-Embedded SiC Power MOSFETs Packaging

Single Level Integrated Packaging Modules For High Performance Electronic Systems

Trends of power semiconductor wafer level packaging

Recent Development of Electronic Packaging Technology

Flexible Circuit Board Package Embedded With Multi-Stack Dies

Modeling and design of coplanar structure in QFP80 package for RFIC applications

A Novel Wafer Level Package Strategy For Rf Mems

Reliability characterization of Chip-on-Wafer-on-Substrate (CoWoS) 3D IC integration technology