Influence of Nano-Aln Particles on Thermal Conductivity, Thermal Stability and Cure Behavior of Cycloaliphatic Epoxy/trimethacrylate System

J. H. Yu,J. K. Duan,W. Y. Peng,L. C. Wang,P. Peng,P. K. Jiang
DOI: https://doi.org/10.3144/expresspolymlett.2011.14
2011-01-01
eXPRESS Polymer Letters
Abstract:We have prepared a series of nano-sized aluminium nitride (nano-AlN)/cycloaliphatic epoxy/trimethacrylate (TMPTMA) systems and investigated their morphology, thermal conductivity, thermal stability and curing behavior. Experimental results show that the thermal conductivity of composites increases with the nano-AlN filler into the epoxy/TMPTMA system improves the thermal stability. For instance, the thermal degradation temperature at 5% weight loss of nano-AlN/epoxy/TMPTMA system with only 1 wt% nano-AlN was improved by similar to 8 degrees C over the neat epoxy/TMPTMA system. The effect of nano-AlN particles on the cure behaviour of epoxy/TMPTMA systems was studied by dynamic differential scanning calorimetry. The results showed that the addition of silane treated nano-AlN particles does not change the curing reaction mechanism and silane treated nano-AlN particles could bring positive effect on the processing of composite since it needs shorter pre-cure time and lower pre-temperature, meanwhile the increase of glass transition temperature of the nanocomposite improves the heat resistance.
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