Effect of Germanium on the Kinetics of Boron-Oxygen Defect Generation and Dissociation in Czochralski Silicon

Xuegong Yu,Peng Wang,Deren Yang
DOI: https://doi.org/10.1063/1.3505499
IF: 4
2010-01-01
Applied Physics Letters
Abstract:We have investigated the kinetics of boron-oxygen (B–O) defect generation and dissociation in germanium-doped Czochralski (GCZ) silicon. It is found that the activation energies for the B–O defect generation and dissociation in the GCZ silicon are around 0.63 eV and 1.52 eV, respectively, both larger than those in the conventional CZ silicon. The corresponding pre-exponential factors also are enhanced by two orders of magnitude due to Ge doping. It is believed that the Ge cannot only cause a higher energy barrier for oxygen-dimer (O2i) diffusion, due to its modulation on the crystal field in silicon lattice but also enhance the capture cross-section of Bs for O2i, as a result of Ge–B complex formation, as predicted by first-principle calculation. These results are significant for us to understand the mechanism of Ge influencing on the B–O defects in CZ silicon.
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