Abstract:A novel porous micro heat sink system is presented for dissipating high heat flux of electronic devices. Numerical model for the micro heat sink is proposed to describe heat transfer in the metallic wall and liquid flow and heat transfer in the porous wick structure, and it is solved with SIMPLE algorithm as a conjugate problem. The numerical results showed that the heated surface temperature of porous micro heat sink is low at high heat fluxes. Increasing inlet fluid velocity can greatly decrease the temperatures of the heated surface temperature and bottom surface. The temperature of the heated surface can maintain good isothermal characteristic when inlet located in the bottom of micro heat sink. ©2010 IEEE.

Conjugate numerical investigation of flow and heat transfer in a novel porous micro heat sink