Coupled Thermal-Mechanical Simulation on Quenching of Aluminum Alloy Thick-Plate Based on ANSYS

YUAN Wang-jiao,WU Yun-xin

2010-01-01

Abstract:The coupled thermal mechanical analysis model of quenched aluminum alloy thick plates was built using ANSYS parametric design language and user interface design language.The parametric simulation and process flow were realized.The rules were explored for the stress of aluminum alloy thick plates to change on quenching and for the residual stress to be formed after quenching.The results indicate that tensile stress is transformed into compressive stress for the surface of aluminum alloy thick plats,while compressive stress is transformed into tensile stress on quenching for the center of aluminum alloy thick plates.The distribution feature of residual stress is taken on compressive stress on surface and tensile stress in center.The residual stress increases with the increase of thickness,but the effect is not obvious when the width increases at a certain degree(80 mm).The residual stress also increases with the increase of surface heat transfer coefficients.The residual stress can be diminished by improving the quench technology.The time step that the heat transfer between aluminum alloy plates and water arrived at balances is adapted to the simulation of the quenched aluminum alloy thick plates.