Abstract:This study investigated the wetting of TC4 substrate by molten Ag-Cu alloy under various high magnetic fields (HMFs) during the heating process. By examining changes in melt morphology, variations in contact angle, and characterizing the interface microstructure, we elucidated the underlying mechanism through which HMFs affected wetting behavior. The findings suggest that higher magnetic flux density resulted in smaller contact angles and more extensive spreading at the same temperature, culminating in a greater final spreading diameter. However, there was no significant difference in the final contact angle under various HMFs. Moreover, higher magnetic flux density resulted in a longer precursor zone and thicker reaction layer. The composition of precursor zones and reaction layers remained consistent with and without an HMF. The spreading process was divided into two stages regardless of the presence or absence of an HMF. In the absence of an HMF, the sluggish formation and spreading of precursor zone led to a lower spreading rate in the first spreading stage. Subsequently, as temperature rose, interface reactions drove rapid melt spreading, accelerating the spreading rate during the second spreading stage. In the presence of HMFs, the strong thermo-electromagnetic convection within melt and at liquid/solid interface notably promoted interface reactions and rapid formation of precursor zones, leading to a substantially heightened spreading rate in the first spreading stage. The slowing reaction rate and the limited volume of the melt collectively resulted in a slower spreading rate in the second spreading stage. This study provides new insights into modifying reactive wetting, with potential applications in advanced brazing techniques.

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