Thermal cycling effects on the oxide scale formation of Fe-Cr alloys for SOFCs

Teruhisa Horita,Masashi Yoshinaga,Haruo Kishimoto,Katsuhiko Yamaji,Manuel E. Brito,Yueping Xiong,Harumi Yokokawa

2009-01-01

Abstract:Thermal cycling effects were investigated on the formation of oxide scales of Fe-Cr alloy interconnects in SOFCs. Thermal cycling between 293 K and 1073 K was examined with heating and cooling rate of 250 K/h. Some large cube shaped oxide grains were formed on the surface, which is due to the grain boundary diffusion of elements from the Fe-Cr alloy. Although the oxide scale/alloy interface showed strong contact without exfoliation, some cracks were found at the oxide scale surface. The elemental distribution in the oxide scales was similar to the normal annealing (without thermal cycling). The growth of oxide scales by thermal cycling is promoted than that of the normal annealing. Some promoting factors were considered by taking into account of microstructures, elemental distributions, and thermal expansion mismatch.