Modeling for Dynamic Recrystallization of Pure Copper with 3-Dimensional Cellular Automaton Method

LIU Wen-bo,ZHANG Chi,YANG Zhi-gang,XU Feng-yun
2009-01-01
Abstract:A modeling of 3-dimensional cellular automaton (CA) method was developed to simulate the dynamic recrystallization(DRX) of pure copper at 400℃ with constant strain rate 0.0005s~(-1) . Mean dislocation density was used to describe the process of nucleation, growth, work harding and dynamic recovery during dynamic recrystallization. The flow stress was calculated by the mean dislocation. Stress-strain curves and changes of the average grain size during DRX of pure copper were simulated. Simulated results agree well with the experimental result in literature.
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