FLUID-THERMAL COUPLING SIMULATION OF FLAT PLATE FILM-COOLING AT HIGH TEMPERATURES

Xin ZOU,Xin YUAN
DOI: https://doi.org/10.3321/j.issn:0253-231X.2009.05.013
2009-01-01
Kung Cheng Je Wu Li Hsueh Pao/Journal of Engineering Thermophysics
Abstract:We have carried out a numerical simulation of the flat plate film cooling of an experiment which is to be conducted.The method used is the fluid-thermal coupling analysis method.This paper mainly deals with three issues:the impact of thermal barrier coating(TBC) on protecting the super alloy plate,the influence of the primary flow injected with water vapor on the film cooling efficiency and the temperature distribution inside the plate in its thickness direction.Through careful analysis, we have found that thermal barrier coating(TBC) can protect the plate surface efficiently,while the introduction of water vapor to the primary flow can decrease the efficiency of film cooling.Further, the temperature distribution inside the solid plate in its thickness direction is nonlinear in the region near the film cooling hole,and is approximately linear when the distance from the hole is long enough.
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