EFFECTS OF A TRENCHED-HOLE,SHAPED HOLE AND COMPOUND ANGLE ON FILM COOLING
Lu SUN,Da-Hai ZHANG,Min ZENG,Qiu-Wang WANG
DOI: https://doi.org/10.3321/j.issn:0253-231X.2009.10.029
2009-01-01
Kung Cheng Je Wu Li Hsueh Pao/Journal of Engineering Thermophysics
Abstract:Numerical simulation technique is used to investigate the effects of a compound angle (30°,45°or 60°)on the film cooling performance based on a trench-shaped hole geometry.From the film cooling efficiency and velocity distribution,the results indicate that the compound angle can improve the lateral coverage of cooling film over a hot surface.Moreover,with the increase of the compound angle,the cooling film shows considerable uniform cover and better cooling performance,especially at a high blowing ratio.
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