Effect of Microwave-Activated Sintering on Microstructure and Properties of Graphite/Copper Composites
Zhimeng Tang,Lei Xu,Zemin Wang,Zhaohui Han,Jianhua Liu
DOI: https://doi.org/10.1021/acsaelm.1c00188
IF: 4.494
2021-04-23
ACS Applied Electronic Materials
Abstract:When the graphite/copper composite is used as an electronic packaging material, it is difficult to take advantage of the thermal conductivity due to its poor interface bonding. In this study, rapid microwave sintering was used to improve the properties of composites, and the wettability between graphite and copper was improved by adding titanium. The results show that microwave sintering can promote the uniform distribution of graphite in the copper matrix, facilitate the effective welding of graphite and copper, and refine the grain size of the copper matrix. Moreover, a uniform transition layer of TiC is formed after adding titanium. After these treatments, the interface bonding between graphite and copper is effectively improved, and the density, hardness, and thermal conductivity of the composites are increased. The thermal conductivity obtained is 1.78 times higher than that of the conventional sintering. Besides, microwave sintering can promote the diffusion of titanium components, which can significantly improve the thermal properties of composites.This article has not yet been cited by other publications.
materials science, multidisciplinary,engineering, electrical & electronic