Thermal analysis for a crack problem in a functionally graded layered structure

Licheng Guo,Hongjun Yu
2008-01-01
Abstract:The thermal problem of a functionally graded layered structure with a crack intersecting the interface is studied. Analytical procedure is presented to obtain the thermal stress intensity factor (TSIF). The influences of the material nonhomogeneity constant and geometry parameters on the TSIF are analyzed. Particularly, the TSIF curves are provided when the crack center moves from one layer into another layer. It is found that the nonhomogeneity properties can influence the TSIF greatly.
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