Abstract:Thermally-induced cracking typically occurs during the cooling stage of various manufacturing processes, and is commonly seen in multiphase or the joints of dissimilar materials due to mismatch in their thermo-mechanical properties, such as thermal expansion, elastic-plastic deformation and, in some cases, phase transformation. However, the underlying cracking mechanism associated with local microstructure is still elusive. To improve the mechanistic understanding of thermal cracking, this work uses the diffusion-bonded 9Cr-1Mo steel as an example to study the key microstructural variables, such as interfacial phases, voids, grain boundary migration and crystallographic orientations. Meanwhile, a temperature-dependent crystal plasticity model coupled with a cohesive zone model is developed to provide more insights into the thermal-induced stress distribution at the grain scale. It is found that the stress at the void-free boundary of martensite and ferrite is dominated by shear, and its magnitude is insufficient to nucleate cracks. Whereas voids at phase boundaries can induce significant tensile stress, resulting in cracking at the phase boundaries as well as diffusion-bonded interfaces. Also, the occurrence of interfacial grain boundary migration plays an important role in local stress distribution. These microstructure features and their evolution are experimentally observed and used to verify the developed crystal plasticity models. These findings enhance the understanding of the influence of microstructure features on thermal cracking and provide a guide to designing and fabricating the microstructure with improved thermal crack resistance in various manufacturing processes.

Thermal analysis for a crack problem in a functionally graded layered structure

Time-dependent analysis of 3D thermo-mechanical behavior of a layered half-space with anisotropic thermal diffusivity

Crack Problems for Functionally Graded Materials under Transient Thermal Loading

Thermoelastic Fracture Mechanics for Nonhomogeneous Material Subjected to Unsteady Thermal Load

Dynamic Stress Intensity Factors of a Semi-Infinite Crack in an Orthotropic Functionally Graded Material

Thermal shock fracture in a cracked strip: Incorporating convective heat transfer between lateral surfaces and ambient environment

Stress analysis for a lip-shaped crack in a thermoelectric plate under combined electrical and thermal loadings

Dynamic Thermal Response of Multiple Interface Cracks between a Half-Plane and a Coating Layer under General Transient Temperature Loading

Thermal stress simulation in TiB2-Cu functionally graded materials

Phase-field modeling of thermal shock fracture in functionally graded materials

Thermal Stress in Functionally Graded Plates with a Gradation of the Coefficient of Thermal Expansion Only

STRESS ANALYSIS OF FUNCTIONALLY GRADED MATERIALS WITH AN ARBITRARILY ORIENTED CRACK

A crack in a confocal elliptical inhomogeneity embedded in an infinite matrix subjected to uniform heat flux

Thermal cracking: clarifying the effects of phases, voids and grains through characterisation and crystal plasticity modelling

Fracture Analysis of Griffith Interface Crack in Fine-Grained Piezoelectric Coating/Substrate under Thermal Loading

Cracks problem for non-homogeneous composite material subjected to dynamic loading

Investigation of Fracture Characterizations of Functionally Graded Materials

Asymptotic Analysis of Thermoelastic Response in Functionally Graded Thin Plate Subjected to a Transient Thermal Shock

Analysis of the crack problem under unified generalized thermoelasticity

The intrinsic relationship of the thermal stress intensity factor and the temperature difference at the crack surface

A 2D discrete heat transfer model considering the thermal resistance effect of fractures for simulating the thermal cracking of brittle materials