A Trusted Execution Environment RISC-V System-on-Chip Compatible with Transport Layer Security 1.3
Binh Kieu-Do-Nguyen,Khai-Duy Nguyen,Tuan-Kiet Dang,Nguyen The The Binh,Cuong Pham-Quoc,Ngoc-Thinh Tran,Cong-Kha Pham,Trong-Thuc Hoang
DOI: https://doi.org/10.3390/electronics13132508
IF: 2.9
2024-06-27
Electronics
Abstract:The Trusted Execution Environment (TEE) is designed to establish a safe environment that prevents the execution of unauthenticated programs. The nature of TEE is a continuous verification process with hashing, signing, and verifying. Such a process is called the Chain-of-Trust, derived from the Root-of-Trust (RoT). Typically, the RoT is pre-programmed, hard-coded, or embedded in hardware, which is locally produced and checked before booting. The TEE employs various cryptographic processes throughout the boot process to verify the authenticity of the bootloader. It also validates other sensitive data and applications, such as software connected to the operating system. TEE is a self-contained environment and should not serve as the RoT or handle secure boot operations. Therefore, the issue of implementing hardware for RoT has become a challenge that requires further investigation and advancement. The main objective of this proposal is to introduce a secured RISC-V-based System-on-Chip (SoC) architecture capable of securely booting a TEE using a versatile boot program while maintaining complete isolation from the TEE processors. The suggested design has many cryptographic accelerators essential for the secure boot procedure. Furthermore, a separate 32-bit MicroController Unit (MCU) is concealed from the TEE side. This MCU manages sensitive information, such as the root key, and critical operations like the Zero Stage BootLoader (ZSBL) and key generation program. Once the RoT is integrated into the isolated sub-system, it becomes completely unavailable from the TEE side, even after booting, using any method. Besides providing a secured boot flow, the system is integrated with essential crypto-cores supporting Transport Layer Security (TLS) 1.3. The chip is finally fabricated using the Complementary Metal–Oxide–Semiconductor (CMOS) 180 nm process.
engineering, electrical & electronic,physics, applied,computer science, information systems