Reliability Test of Aircraft Integrated Electronic Assemblies Based on Virtual Qualification Method
Xingliu Zhang,Zhifeng Xie,Zili Wang,Chen Lu
DOI: https://doi.org/10.1109/phm-nanjing52125.2021.9613086
2021-01-01
Abstract:With the rapid development of aeronautic technology, modular electronic assemblies have begun to be applied widely in aeronautic products. However, inadequately validated assemblies could introduce failure risks to the flight missions. Therefore, the reliability test of the electronic assemblies is significant to verify the prototypes and identify the defects for each mission. In order to optimize the test costs and determine the suitable test duration, a virtual qualification method for the reliability test was proposed. In this paper, the mission profile was analyzed firstly in detail during the service life of the aircraft, such as vibration, thermal cycling, power consumptions, etc. The design characteristics of the electronic assemblies for aircraft were introduced. Further, the methodology based on the finite element analysis and virtual qualification method was proposed to calculate the acceleration factors of the mission profile and potential test profiles. By using the digital prototype, a virtual qualification was performed to test and evaluate the assemblies. Finally, a case was completed to guide engineering applications by using real aircraft electronic assemblies.